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Long Lau, Boon
213  Ergebnisse:
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1

A Compact Wafer-Level Heterogeneously Integrated Scalable O..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Nair Gourikutty, Sajay Bhuvanendran ; Wu, Jiaqi ; Lim, Teck Guan... - p. 1398-1403 , 2024
Link: https://doi.org/10.1109/..
 
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2

A Heterogeneously Integrated Wafer-level Processed Co-Packa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Nair Gourikutty, Sajay Bhuvanendran ; Long, Lau Boon ; Wei, Seit Wen... - p. 207-211 , 2023
Link: https://doi.org/10.1109/..
 
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3

3D Stacking of Heterogeneous Chiplets on Modified FOWLP Pla..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chong, Chai Tai ; Long, Lau Boon ; Siang, Sharon Lim Pei... - p. 24-28 , 2023
Link: https://doi.org/10.1109/..
 
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4

Wafer Level Fabrication of Embedded Silicon Microcooler on ..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Long, Lau Boon ; Ong, Javier ; Au, Jason... - p. 1063-1066 , 2023
Link: https://doi.org/10.1109/..
 
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5

Assembly process characterization of 3D Stacking of Heterog..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Siang Lim, Sharon Pei ; Long Lau, Boon ; Chai, Tai Chong. - p. 24-28 , 2023
Link: https://doi.org/10.1109/..
 
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6

Wafer Level Package with Polymer Sealed Air Cavity:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Ho, Soon Wee ; Siew Boon, Serine Soh ; Long, Lau Boon. - p. 598-602 , 2022
Link: https://doi.org/10.1109/..
 
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7

RF Performance of FOWLP to PCB Board Transition:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Zheng, Kai Bo ; Mei, Sun ; Siang, Sharon Lim Pei... - p. 94-97 , 2022
Link: https://doi.org/10.1109/..
 
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8

Development of Two-Tier FO-WLP AiPs for Automotive Radar Ap..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Ho, Soon Wee ; Hsiang-Yao, Hsiao ; Long, Lau Boon... - p. 1376-1383 , 2022
Link: https://doi.org/10.1109/..
 
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9

Ka-Band AiP Array in Mold-on-Mold FOWLP technology:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Mei, Sun ; Guan, Lim Teck ; Lin, Zhou... - p. 62-65 , 2022
Link: https://doi.org/10.1109/..
 
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10

Double Mold Fan-Out Wafer Level Packaging for AiP Applicati..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Long, Lau Boon ; Ho, David ; Guan, Lim Teck.. - p. 01-06 , 2022
Link: https://doi.org/10.1109/..
 
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11

A Study to Reduce Molding Film Defects During Vacuum Lamina..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Long, Lau Boon ; Ho, David ; Ps, Sharon Lim. - p. 130-134 , 2020
Link: https://doi.org/10.1109/..
 
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12

Double Mold Antenna in Package for 77 GHz Automotive Radar:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Ho, Soon Wee ; Boon, Soh Siew ; Long, Lau Boon... - p. 257-261 , 2020
Link: https://doi.org/10.1109/..
 
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13

Si-based Hybrid Micro-cooler Fabrication Process Developmen:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Long, Lau Boon ; Yong, Han ; Xiaowu, Zhang - p. 179-183 , 2019
Link: https://doi.org/10.1109/..
 
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14

Thermo-mechanical design of fan-out wafer level package for..:

, In: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC),
Chen, Zhaohui ; Gongyue, Tang ; Long, Lau Boon... - p. 1-6 , 2017
Link: https://doi.org/10.1109/..
 
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15

Two-Phase Liquid Cooling for High-Power Microelectronics vi..:

Feng, Huicheng ; Tang, Gongyue ; Zhang, Xiaowu...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  3 - p. 397-405 , 2024
Link: https://doi.org/10.1109/..
 
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