Lum, I.
303  Ergebnisse:
Personensuche X
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2

Effect of electronic flame off parameters on copper bonding..:

Hang, C.J. ; Song, W.H. ; Lum, I....
Microelectronic Engineering.  86 (2009)  10 - p. 2094-2103 , 2009
 
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3

Effects of superimposed ultrasound on deformation of gold:

Lum, I. ; Huang, H. ; Chang, B. H....
Journal of Applied Physics.  105 (2009)  2 - p. , 2009
 
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4

In Situ Studies of the Effect of Ultrasound During Deformat..:

Lum, I. ; Hang, C. J. ; Mayer, M..
Journal of Electronic Materials.  38 (2009)  5 - p. 647-654 , 2009
 
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5

Bonding wire characterization using automatic deformability..:

Hang, C.J. ; Lum, I. ; Lee, J....
Microelectronic Engineering.  85 (2008)  8 - p. 1795-1803 , 2008
 
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6

Microelectronics wire bonding:

, In: Microjoining and Nanojoining,
Lum, I. ; Mayer, M. ; Zhou, Y. - p. 205-233 , 2008
 
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7

Footprint study of ultrasonic wedge-bonding with aluminum w..:

Lum, I. ; Mayer, M. ; Zhou, Y.
Journal of Electronic Materials.  35 (2006)  3 - p. 433-442 , 2006
 
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8

Bonding mechanism in ultrasonic gold ball bonds on copper s..:

Lum, I. ; Jung, J. P. ; Zhou, Y.
Metallurgical and Materials Transactions A.  36 (2005)  5 - p. 1279-1286 , 2005
 
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9

Electrode pitting in resistance spot welding of aluminum al..:

Lum, I. ; Biro, E. ; Zhou, Y...
Metallurgical and Materials Transactions A.  35 (2004)  1 - p. 217-226 , 2004
 
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12

Quantum criticality and superconducting pairing in Ce1-xYbx..:

Singh, Y P ; Haney, D J ; Lum, I K...
Journal of Physics: Conference Series.  592 (2015)  - p. 012078 , 2015
 
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