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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
1
A combined simulation and experimental study on cracking an..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
2
An Extensive Study of the Effects of Packaging Structure an..:
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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
3
Finite Element Simulation Study of the Effects of Kirkendal..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
4
Interfacial Delamination Characterization and Thermo-mechan..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
5
A Comprehensive Study of Crack Initiation and Delamination ..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
6
An extensive simulation study of the interfacial delaminati..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
7
Three-dimensional Finite Element Analysis of Interfacial De..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
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