Machillot, J.
96  Ergebnisse:
Personensuche X
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1

Low Resistance Cu Vias for 24nm Pitch and Beyond:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),
 
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2

Reliability benchmark of various via prefill metals:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),
 
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3

Exploring W-Cu hybrid dual damascene metallization for futu..:

, In: 2021 IEEE International Interconnect Technology Conference (IITC),
 
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4

3D-carrier Profiling and Parasitic Resistance Analysis in V..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Eyben, P. ; Machillot, J. ; Kim, M.... - p. 11.3.1-11.3.4 , 2019
 
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9

Interplay between integrins and cadherins to control bone d..:

Valat, Anne ; Fourel, Laure ; Sales, Adria...
Frontiers in Cell and Developmental Biology.  10 (2023)  - p. , 2023
 
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11

Engineering of a Microscale Niche for Pancreatic Tumor Cell..:

Rengaraj, Arunkumar ; Bosc, Lauriane ; Machillot, Paul...
ACS Applied Materials & Interfaces.  14 (2022)  11 - p. 13107-13121 , 2022
 
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12

Automated Fabrication of Streptavidin-Based Self-assembled ..:

Sefkow-Werner, Julius ; Le Pennec, Jean ; Machillot, Paul...
ACS Applied Materials & Interfaces.  14 (2022)  29 - p. 34113-34125 , 2022
 
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