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2022 IEEE International Interconnect Technology Conference (IITC) ,
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Low Resistance Cu Vias for 24nm Pitch and Beyond:
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2022 IEEE International Interconnect Technology Conference (IITC) ,
2
Reliability benchmark of various via prefill metals:
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2021 IEEE International Interconnect Technology Conference (IITC) ,
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Exploring W-Cu hybrid dual damascene metallization for futu..:
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2019 IEEE International Electron Devices Meeting (IEDM) ,
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