Majkic, Goran
32  Ergebnisse:
Personensuche X
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1

A 6-around-1 cable using high-temperature superconducting S..:

Castaneda, Nathaly ; Ferracin, Paolo ; Funkhouser, Cyrus...
Superconductor Science and Technology.  37 (2024)  3 - p. 035009 , 2024
 
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2

Role of customized scan strategies and dwell time on micros..:

Pathak, Puskar ; Majkic, Goran ; Selvamanickam, Venkat
Materials Science in Additive Manufacturing.  3 (2024)  1 - p. 2676 , 2024
 
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3

Development of 50-Meter RE-Ba-Cu-O Tapes With Critical Curr..:

Paidpilli, Mahesh ; Goel, Chirag ; Chen, Siwei...
IEEE Transactions on Applied Superconductivity.  33 (2023)  5 - p. 1-5 , 2023
 
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5

Accurate Ruby Sensor for Stress Analysis in Electronics:

Yang, Wenli ; Cortés-Vega, Fernando D. ; Ahmadi, Kamyar...
ACS Applied Electronic Materials.  4 (2022)  9 - p. 4332-4339 , 2022
 
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7

New insight into strain and composition of BaZrO3 nanorods ..:

Majkic, Goran ; Jeong, Jong Seok ; Yun, Hwanhui...
Superconductor Science and Technology.  34 (2021)  11 - p. 115002 , 2021
 
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10

In-field critical current and pinning mechanisms at 4.2 K o..:

Galstyan, Eduard ; Pratap, Rudra ; Majkic, Goran...
Superconductor Science and Technology.  33 (2020)  7 - p. 074007 , 2020
 
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11

Progress in scale-up of REBCO STAR™ wire for canted cosine ..:

Kar, Soumen ; Sandra, Jithin Sai ; Luo, Wenbo...
Superconductor Science and Technology.  33 (2020)  9 - p. 094001 , 2020
 
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12

In-field critical current performance of 4.0 μm thick film ..:

Majkic, Goran ; Pratap, Rudra ; Paidpilli, Mahesh...
Superconductor Science and Technology.  33 (2020)  7 - p. 07LT03 , 2020
 
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13

Next-generation highly flexible round REBCO STAR wires with..:

Kar, Soumen ; Sandra, Jithin Sai ; Luo, Wenbo...
Superconductor Science and Technology.  32 (2019)  10 - p. 10LT01 , 2019
 
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14

Progress in Thick Film 2G-HTS Development:

, In: Superconductivity,
Majkic, Goran - p. 73-131 , 2019
 
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15

Erratum: Symmetric tape round REBCO wire with J e (4.2 K, 1..:

Kar, Soumen ; Luo, Wenbo ; Ben Yahia, Anis...
Superconductor Science and Technology.  31 (2018)  5 - p. 059601 , 2018
 
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