Manier, Charles Alix
18  Ergebnisse:
Personensuche X
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1

Wafer Level Capping Technology for Vacuum Packaging of Micr..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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2

Investigation and Modeling of Etching Through Silicon Carbi..:

Mackowiak, Piotr ; Erbacher, Kolja ; Schiffer, Michael...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  3 - p. 437-445 , 2022
 
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7

Slip-rolling resistance of novel Zr(C,N) thin film coatings..:

Manier, Charles-Alix (Dipl.-Ing.)
https://opus4.kobv.de/opus4-bam/frontdoor/index/index/docId/98.  , 2010
 
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