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X
Marushima, Chinami
11  Ergebnisse:
Personensuche X
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1

Scalable Advanced DBHi Chiplet Package Using Silicon Bridge..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Horibe, Akihiro ; Watanabe, Takahito ; Marushima, Chinami... - p. 269-273 , 2024
Link: https://doi.org/10.1109/..
 
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2

Dimensional Parameters Controlling Capillary Underfill Flow..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Marushima, Chinami ; Aoki, Toyohiro ; Nakamura, Koki... - p. 586-590 , 2022
Link: https://doi.org/10.1109/..
 
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3

Characterization of Non-Conductive Paste Materials (NCP) fo..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Horibe, Akihiro ; Watanabe, Takahito ; Marushima, Chinami... - p. 625-630 , 2022
Link: https://doi.org/10.1109/..
 
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4

Thermomechanical Analysis on Stress Mitigation of FCPBGA wi..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Hisada, Takashi ; Kohara, Sayuri ; Marushima, Chinami. - p. 207-208 , 2022
Link: https://doi.org/10.23919..
 
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5

Surface Silicon Bridge Direct Bonded Heterogeneous Integrat..:

, In: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Sikka, Kamal ; Sousa, Isabel De ; Jain, Aakrati... - p. 145-147 , 2022
Link: https://doi.org/10.1109/..
 
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6

Super Fine Jet Underfill Dispense Technique for Robust Micr..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Horibe, Akihiro ; Marushima, Chinami ; Watanabe, Takahito... - p. 631-634 , 2022
Link: https://doi.org/10.1109/..
 
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7

Analysis of process dependent mechanical properties of sint..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Kohara, Sayuri ; Aoki, Toyohiro ; Marushima, Chinami... - p. 1-8 , 2022
Link: https://doi.org/10.1109/..
 
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8

Morphology and Mechanical property of Cu pillar formed by s..:

, In: 2021 International Conference on Electronics Packaging (ICEP),
Marushima, Chinami ; Aoki, Toyohiro ; Kohara, Sayuri... - p. 121-122 , 2021
Link: https://doi.org/10.23919..
 
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9

Plating-free Bumping by Cu Nanopaste and Injection Molded S..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Aoki, Toyohiro ; Nakamura, Eiji ; Kohara, Sayuri... - p. 742-748 , 2020
Link: https://doi.org/10.1109/..
 
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10

Direct Fabrication for Multimode/Single-mode Polymer Optica..:

, In: 2018 IEEE CPMT Symposium Japan (ICSJ),
MARUSHIMA, Chinami ; ISHIGURE, Takaaki - p. 159-162 , 2018
Link: https://doi.org/10.1109/..
 
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11

Design and Fabrication of Broadband Polymer Mode (De)Multip..:

Xiao Xu ; Lin Ma ; Chinami Marushima..
https://ieeexplore.ieee.org/document/8528836/.  , 2018
Link: https://doi.org/10.1109/..
 
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