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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
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Fast Liquid-to-Liquid Thermal Shock: Experimental Assessmen..:
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
2
Thermography Analysis of Automotive SiC Power Modules for R..:
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
3
Development of a Computational Fluid Dynamics Model to Eval..:
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Lecture Notes in Mechanical Engineering; Design Tools and Methods in Industrial Engineering III ,
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Experimental Reliability Assessment of ACEPACK SMIT Power M..:
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
5
Characterization and simulation of four bending test to est..:
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2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE) ,
6
Thermal Impedance Computation of a SiC Power Module for Tra..:
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2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM) ,
9
The reliability challenge of SiC Power Modules in Automotiv..:
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2020 2nd IEEE International Conference on Industrial Electronics for Sustainable Energy Systems (IESES) ,
11
Analysis of the impact of the operating parameters on the v..:
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2019 IEEE Energy Conversion Congress and Exposition (ECCE) ,
12
Si and GaN Devices in Quasi Resonant Flyback converters for..:
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IECON 2019 - 45th Annual Conference of the IEEE Industrial Electronics Society ,
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SiC Power Modules for Traction Inverters in Automotive Appl..:
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2019 AEIT International Annual Conference (AEIT) ,
14
Effects of parasitic phenomena in half bridge with Super Ju..:
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IECON 2019 - 45th Annual Conference of the IEEE Industrial Electronics Society ,
15