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Mazure, C.
617  Ergebnisse:
Personensuche X
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1

Pre-assessment of a new access HIV combo version:

Ciczora, Y. ; Falcou-Briatte, R. ; Bertheault, L....
Clinica Chimica Acta.  493 (2019)  - p. S558 , 2019
Link: https://doi.org/10.1016/..
 
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2

Technology evening panel discussion transistor future; How ..:

, In: 2017 Symposium on VLSI Technology,
Tsunomura, T. ; Mazure, C. ; Woo, J.... - p. T66-T66 , 2017
Link: https://doi.org/10.23919..
 
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3

Comparative evaluations of the New Access® HCV Ab V3 Assay ..:

Nogues, D. ; Guerrier, L. ; Falcou-Briatte, R....
Journal of Clinical Virology.  70 (2015)  - p. S95 , 2015
Link: https://doi.org/10.1016/..
 
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4

Paratriathlon: Method for physical and social rehabilitatio:

Collado, H. ; Mazure, C. ; Becker, N..
Annals of Physical and Rehabilitation Medicine.  57 (2014)  - p. e271 , 2014
Link: https://doi.org/10.1016/..
 
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5

Paratriathlon : outil de réadaptation physique et sociale:

Collado, H. ; Mazure, C. ; Becker, N..
Annals of Physical and Rehabilitation Medicine.  57 (2014)  - p. e284-e285 , 2014
Link: https://doi.org/10.1016/..
 
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6

A new characterization technique for SOI wafers: Split C(V)..:

Diab, A. ; Fernández, C. ; Ohata, A....
Solid-State Electronics.  90 (2013)  - p. 127-133 , 2013
Link: https://doi.org/10.1016/..
 
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7

Splitting kinetics of Si0.8Ge0.2 layers implanted with H or..:

Nguyen, Phuong ; Bourdelle, K. K. ; Aulnette, C....
Journal of Applied Physics.  104 (2008)  11 - p. , 2008
Link: https://doi.org/10.1063/..
 
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8

Impact of Mobility Boosters (XsSOI, CESL, TiN gate) on the ..:

, In: 2007 IEEE Symposium on VLSI Technology,
Andrieu, F. ; Aussenac, F. ; Feruglio, S.... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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9

Strain-Enhanced CMOS Through Novel Process-Substrate Stress..:

, In: 2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers.,
Mazure, C. ; Cayrefourcq, I. ; Mogab, J.... - p. 130-131 , 2006
Link: https://doi.org/10.1109/..
 
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10

25nm Short and Narrow Strained FDSOI with TiN/HfO2 Gate Sta..:

, In: 2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers.,
Deleonibus, S. ; Mazure, C. ; Gaud, P.... - p. 134-135 , 2006
Link: https://doi.org/10.1109/..
 
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11

Integration of buried insulators with high thermal conducti..:

Bresson, N. ; Cristoloveanu, S. ; Mazuré, C...
Solid-State Electronics.  49 (2005)  9 - p. 1522-1528 , 2005
Link: https://doi.org/10.1016/..
 
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12

Knowledge and perceived risk of smoking-related conditions:..:

ONCKEN, C ; MCKEE, S ; KRISHNANSARIN, S..
Preventive Medicine.  40 (2005)  6 - p. 779-784 , 2005
Link: https://doi.org/10.1016/..
 
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13

Current status and future perspectives of wafer bonding (Sm..:

, In: Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004.,
Yoshimi, M. ; Mazure, C. - p. 258,259,260,261 , 2004
Link: https://doi.org/10.1109/..
 
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14

Engineering strained silicon on insulator wafers with the S..:

Ghyselen, B. ; Hartmann, J.-M. ; Ernst, T....
Solid-State Electronics.  48 (2004)  8 - p. 1285-1296 , 2004
Link: https://doi.org/10.1016/..
 
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15

New layer transfers obtained by the SmartCut process:

Moriceau, H. ; Fournel, F. ; Aspar, B....
Journal of Electronic Materials.  32 (2003)  8 - p. 829-835 , 2003
Link: https://doi.org/10.1007/..
 
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