Medgyes, Balint
40  Ergebnisse:
Personensuche X
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1

Effect of Incorporation of Ceramic Nanoparticles in Bismuth..:

, In: 2023 46th International Spring Seminar on Electronics Technology (ISSE),
 
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3

Effect of TiO2 Nanoparticles Addition on the Electrochemica..:

, In: 2023 46th International Spring Seminar on Electronics Technology (ISSE),
 
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4

Electrochemical Corrosion Assessment of Low-Ag SAC Lead-Fre..:

, In: 2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME),
Gharaibeh, Ali ; Medgyes, Balint - p. 127-131 , 2023
 
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5

Electrochemical Migration Investigation on Lead-Free Sn-bas..:

, In: 2022 45th International Spring Seminar on Electronics Technology (ISSE),
 
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6

Electrochemical migration investigation on SAC alloys incor..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Gharaibeh, Ali ; Medgyes, Balint - p. 484-487 , 2022
 
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7

Novel PLA/Flax Based Biodegradable Printed Circuit Boards:

, In: 2022 45th International Spring Seminar on Electronics Technology (ISSE),
Geczy, Attila ; Csiszar, Andras ; Rozs, Egon... - p. 1-6 , 2022
 
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8

Status Report of Training Development in the METIS Project ..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Medgyes, Balint ; Illes, Balazs ; Krammer, Oliver... - p. 292-296 , 2022
 
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9

Numerical simulation of electrochemical migration of Cu bas..:

Illés, Balázs ; Medgyes, Bálint ; Dušek, Karel...
International Journal of Heat and Mass Transfer.  184 (2022)  - p. 122268 , 2022
 
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12

Influence of Ni, Bi, and Sb additives on the microstructure..:

Li, Feng ; Verdingovas, Vadimas ; Dirscherl, Kai...
Journal of Materials Science: Materials in Electronics.  31 (2020)  18 - p. 15308-15321 , 2020
 
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13

Erosion-corrosion and its mitigation on the internal surfac..:

Shang, Tan ; Zhong, Xian-kang ; Zhang, Chen-feng..
International Journal of Minerals, Metallurgy and Materials.  28 (2020)  1 - p. 98-110 , 2020
 
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15

Reliability Tests on SAC-xMn Solder Alloys:

, In: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME),
 
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