E-LIB Suche - Ergebnisse für: Mei, Yun-Hui

1

Reliable WBG Devices Packaging by Forming Nano-gradient Str..:

Zhang, Bowen ; Zhao, Zhiyuan ; Liu, Yi...
IEEE Transactions on Components, Packaging and Manufacturing Technology. , 2024

Link: https://doi.org/10.1109/..

2

Development of Silver Paste With High Sintering Driving For..:

Zhang, Bowen ; Lu, Xinyan ; Ma, Haoxiang..
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 1 - p. 10-17 , 2024

Link: https://doi.org/10.1109/..

3

Local Interconnection Degradation of a Double-Sided Cooling..:

Chen, Yue ; Mei, Yun-Hui ; Ning, Puqi.
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 5 - p. 832-840 , 2024

Link: https://doi.org/10.1109/..

4

Copper-Wire Stress Buffers for Extending Lifetime of Double..:

Liu, Siqi ; Mei, Yun-Hui ; Li, Jing..
IEEE Transactions on Power Electronics. 38 (2023) 6 - p. 7118-7127 , 2023

Link: https://doi.org/10.1109/..

5

Insulation and Reliability Enhancement by a Nonlinear Condu..:

Sun, Kai-Bing ; Mei, Yun-Hui ; Shuai, Zhi-Bin.
IEEE Transactions on Dielectrics and Electrical Insulation. 30 (2023) 6 - p. 2514-2521 , 2023

Link: https://doi.org/10.1109/..

6

Reliability Improvement of Low-Temperature Sintered Nano-Si..:

Zhang, Bowen ; Zhang, Shaoqiong ; Lu, Xinyan..
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 8 - p. 1209-1217 , 2023

Link: https://doi.org/10.1109/..

7

A Double-Sided 650 V GaN Power Device Using Flexible Buffer..:

, In: 2023 IEEE 14th International Symposium on Power Electronics for Distributed Generation Systems (PEDG),

Liu, Siqi ; Li, Longnv ; Mei, Yun-Hui - p. 169-173 , 2023

Link: https://doi.org/10.1109/..

8

Review of Double-Sided Cooling Power Modules for Driving El..:

Lu, Panpan ; Li, Longnv ; Lu, Guo-Quan...
IEEE Transactions on Device and Materials Reliability. 23 (2023) 2 - p. 287-296 , 2023

Link: https://doi.org/10.1109/..

9

A Reliable Way to Improve Electrochemical Migration (ECM) R..:

Ding, Zikun ; Wang, Zhichao ; Zhang, Bowen..
Applied Sciences. 12 (2022) 9 - p. 4748 , 2022

Link: https://doi.org/10.3390/..

10

Reliability Behavior of A Resin-Free Nanosilver Paste at Ul..:

Zhang, Bowen ; Chen, Shi ; Lu, Guo-Quan..
Power Electronic Devices and Components. 3 (2022) - p. 100014 , 2022

Link: https://doi.org/10.1016/..

11

Reliable epoxy/SiC composite insulation coating for high-vo..:

Liang, Yu ; Zhu, Gaojia ; Lu, Guo-Quan.
Journal of Materials Science: Materials in Electronics. 33 (2022) 26 - p. 20508-20517 , 2022

Link: https://doi.org/10.1007/..

12

Reliable Aluminum Wire-Bonded SiC/Si Diodes With Laminated ..:

Li, Xiao-Di ; Lu, Guo-Quan ; Mei, Yun-Hui
IEEE Transactions on Power Electronics. 37 (2022) 9 - p. 10149-10153 , 2022

Link: https://doi.org/10.1109/..

13

Large-Area Bonding by Sintering of a Resin-Free Nanosilver ..:

Chen, Shi ; Mei, Yun-Hui ; Wang, Meiyu..
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12 (2022) 4 - p. 707-710 , 2022

Link: https://doi.org/10.1109/..

14

High-Temperature Characterizations of a Half-Bridge Wire-Bo..:

Chen, Yue ; Lei, Guangyin ; Lu, Guo-Quan.
IEEE Journal of the Electron Devices Society. 9 (2021) - p. 966-971 , 2021

Link: https://doi.org/10.1109/..

15

Pressureless sintering multi-scale Ag paste by a commercial..:

Yan, Haidong ; Mei, Yun-Hui ; Wang, Meiyu..
Journal of Materials Science: Materials in Electronics. 30 (2019) 10 - p. 9634-9641 , 2019

Link: https://doi.org/10.1007/..