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Mei, Zhouzhouzhou
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A novel joint segmentation approach for wafer surface defec..:

Mei, Zhouzhouzhou ; Luo, Yuening ; Qiao, Yibo.
Journal of Intelligent Manufacturing.  , 2024
Link: https://doi.org/10.1007/..
 
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High Performance Wafer Defect Classification Model Based on..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Shi, Zhongyu ; Mei, Zhouzhouzhou ; Zeng, Lichao. - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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DeepSEM-Net: Enhancing SEM defect analysis in semiconductor..:

Qiao, Yibo ; Mei, Zhouzhouzhou ; Luo, Yuening.
Computers & Industrial Engineering.  193 (2024)  - p. 110301 , 2024
Link: https://doi.org/10.1016/..
 
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