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Milojevic, Dragomir
72  Ergebnisse:
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1

Hier-3D: A Methodology for Physical Hierarchy Exploration o..:

Bethur, Nesara Eranna ; Agnesina, Anthony ; Brunion, Moritz...
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  43 (2024)  7 - p. 1957-1970 , 2024
Link: https://doi.org/10.1109/..
 
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2

3D Partitioning with Pipeline Optimization for Low-Latency ..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Das, Sudipta ; Riedel, Samuel ; Bertuletti, Marco... - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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3

Power, Performance, Area, and Cost Analysis of Face-to-Face..:

Agnesina, Anthony ; Brunion, Moritz ; Kim, Jinwoo...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  3 - p. 300-314 , 2023
Link: https://doi.org/10.1109/..
 
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4

Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch..:

, In: 2023 IEEE International 3D Systems Integration Conference (3DIC),
Naeim, Mohamed ; Yang, Hanqi ; Chen, Pinhong... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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5

Impact of gate-level clustering on automated system partiti..:

Delhaye, Quentin ; Beyne, Eric ; Goossens, Joël..
Microelectronics Journal.  139 (2023)  - p. 105896 , 2023
Link: https://doi.org/10.1016/..
 
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6

Ruthenium Metallization and Via Prefill for Electromigratio..:

, In: 2023 IEEE International Integrated Reliability Workshop (IIRW),
Esposto, Simone ; Sisto, Giuliano ; Ciofi, Ivan... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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7

Evaluation of Nanosheet and Forksheet Width Modulation for ..:

Sisto, Giuliano ; Zografos, Odysseas ; Chehab, Bilal...
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  30 (2022)  10 - p. 1497-1506 , 2022
Link: https://doi.org/10.1109/..
 
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8

Espresso to the rescue of genetic programming facing expone..:

, In: Proceedings of the Genetic and Evolutionary Computation Conference Companion,
Potvin, Nicolas ; Bersini, Hugues ; Milojevic, Dragomir - p. 590-593 , 2022
Link: https://dl.acm.org/doi/1..
 
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9

Hier-3D: A Hierarchical Physical Design Methodology for Fac..:

, In: Proceedings of the ACM/IEEE International Symposium on Low Power Electronics and Design,
Agnesina, Anthony ; Brunion, Moritz ; Garcia-Ortiz, Alberto... - p. 1-6 , 2022
Link: https://dl.acm.org/doi/1..
 
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10

Opportunities of Chip Power Integrity and Performance Impro..:

, In: Proceedings of the 24th ACM/IEEE Workshop on System Level Interconnect Pathfinding,
Chen, Rongmei ; Sisto, Giuliano ; Zografos, Odysseas... - p. 1-5 , 2022
Link: https://dl.acm.org/doi/1..
 
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11

Exploring the security landscape: NoC-based MPSoC to Cloud-..:

Sharma, Gaurav ; Bousdras, Georgios ; Ellinidou, Soultana...
Microprocessors and Microsystems.  84 (2021)  - p. 103963 , 2021
Link: https://doi.org/10.1016/..
 
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12

3D SoC integration, beyond 2.5D chiplets:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Beyne, Eric ; Milojevic, Dragomir ; Van der Plas, Geert. - p. 3.6.1-3.6.4 , 2021
Link: https://doi.org/10.1109/..
 
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13

Power, performance, area and cost analysis of memory-on-log..:

, In: Proceedings of the ACM/IEEE International Symposium on Low Power Electronics and Design,
Agnesina, Anthony ; Brunion, Moritz ; Kim, Jinwoo... - p. 1-6 , 2021
Link: https://dl.acm.org/doi/1..
 
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14

High-Performance Logic-on-Memory Monolithic 3-D IC Designs ..:

Zhu, Lingjun ; Bamberg, Lennart ; Pentapati, Sai Surya Kiran...
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  29 (2021)  6 - p. 1152-1163 , 2021
Link: https://doi.org/10.1109/..
 
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15

Heterogeneous 3D Integration for a RISC-V System With STT-M..:

Zhu, Lingjun ; Bamberg, Lennart ; Agnesina, Anthony...
IEEE Computer Architecture Letters.  19 (2020)  1 - p. 51-54 , 2020
Link: https://doi.org/10.1109/..
 
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