Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Mirkarimi, Laura
11  Ergebnisse:
Personensuche X
?
1

Deep Convolution Neural Networks for Automatic Detection of..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Zhao, Oliver ; Suwito, Dominik ; Lee, Bongsub.. - p. 491-497 , 2024
Link: https://doi.org/10.1109/..
 
?
2

High-Throughput Characterization of Nanoscale Topography fo..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Bongsub ; Zhao, Oliver ; Avellan, Arianna... - p. 969-975 , 2024
Link: https://doi.org/10.1109/..
 
?
3

Fine Pitch Die-to-Wafer Hybrid Bonding:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Mirkarimi, Laura ; Workman, Thomas ; Theil, Jeremy... - p. 83-90 , 2023
Link: https://doi.org/10.1109/..
 
?
4

The Influence of Cu Microstructure on Thermal Budget in Hyb..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Mirkarimi, Laura ; Uzoh, Cyprian ; Suwito, Dominik... - p. 162-167 , 2022
Link: https://doi.org/10.1109/..
 
?
5

Die to Wafer Hybrid Bonding for Chiplet and Heterogeneous I..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Gao, Guilian ; Mirkarimi, Laura ; Fountain, Gill... - p. 1975-1981 , 2022
Link: https://doi.org/10.1109/..
 
?
6

Analysis of Die Edge Bond Pads in Hybrid Bonded Multi-Die S..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Theil, Jeremy A. ; Workman, Thomas ; Suwito, Dominik... - p. 130-136 , 2022
Link: https://doi.org/10.1109/..
 
?
7

Die to Wafer Stacking with Low Temperature Hybrid Bonding:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Gao, Guilian ; Workman, Thomas ; Uzoh, Cyprian... - p. 589-594 , 2020
Link: https://doi.org/10.1109/..
 
?
8

Recent Developments in Fine Pitch Wafer-To-Wafer Hybrid Bon..:

, In: 2019 International Wafer Level Packaging Conference (IWLPC),
Theil, Jeremy A. ; Mirkarimi, Laura ; Fountain, Gill.. - p. 1-6 , 2019
Link: https://doi.org/10.23919..
 
?
9

Chip to Wafer Hybrid Bonding with Cu Interconnect: High Vol..:

, In: 2019 International Wafer Level Packaging Conference (IWLPC),
Gao, Guilian ; Mrozek, Pawel ; Workman, Thomas... - p. 1-9 , 2019
Link: https://doi.org/10.23919..
 
?
10

Photonic crystal microcavity sensor for ultracompact monito..:

Zlatanovic, Sanja ; Mirkarimi, Laura W. ; Sigalas, Mihail M....
Sensors and Actuators B: Chemical.  141 (2009)  1 - p. 13-19 , 2009
Link: https://doi.org/10.1016/..
 
?
11

Deuterium-induced degradation of (Ba, Sr)TiO3 films:

Ahn, Joon-Hyung ; McIntyre, Paul C. ; Mirkarimi, Laura Wills...
Applied Physics Letters.  77 (2000)  9 - p. 1378-1380 , 2000
Link: https://doi.org/10.1063/..
 
1-11