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1

Integration of Thin Film Electrodes for Microfluidic Electr..:

, In: 2023 IEEE SENSORS,

Vereshchagina, Elizaveta ; Kolczyk-Siedlecka, Karolina ; Szklarz, Zbigniew... - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

2

Microfluidic Nanospray Emitters with a Liquid Junction for ..:

, In: 2023 IEEE SENSORS,

Vereshchagina, Elizaveta ; Vaclavek, Tomas ; Summanwar, Anand... - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

3

Wafer bonding process for zero level vacuum packaging of ME..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),

Sordo, Guido ; Collini, Cristian ; Moe, Sigurd.. - p. 1-4 , 2020

Link: https://doi.org/10.1109/..

4

Integrated Fibre Optic Subsea System:

Johannessen, Kjetil ; Andreassen, Jon Steinar ; Moe, Sigurd
Measurement and Control. 42 (2009) 4 - p. 107-112 , 2009

Link: https://doi.org/10.1177/..

5

Low-temperature plasma activated bonding for a variable opt..:

Schjølberg-Henriksen, Kari ; Moe, Sigurd ; Taklo, Maaike M. Visser..
Sensors and Actuators A: Physical. 142 (2008) 1 - p. 413-420 , 2008

Link: https://doi.org/10.1016/..

6

Development of cost-effective high-density through-wafer in..:

Lietaer, Nicolas ; Storås, Preben ; Breivik, Lars.
Journal of Micromechanics and Microengineering. 16 (2006) 6 - p. S29-S34 , 2006

Link: https://doi.org/10.1088/..

7

Plastic Deformation of Thin Si Membranes in Si-Si Direct Bo..:

Poppe, Erik ; Jensen, Geir Uri ; Moe, Sigurd Teodor.
ECS Transactions. 75 (2016) 9 - p. 311-319 , 2016

Link: https://doi.org/10.1149/..

8

Conductivity of high-temperature annealed silicon direct wa..:

Schjølberg-Henriksen, Kari ; Tvedt, Lars Geir Whist ; Gjelstad, Stein Are...
Microsystem Technologies. 21 (2015) 5 - p. 979-985 , 2015

Link: https://doi.org/10.1007/..

9

Electrical, Mechanical, and Hermeticity Properties of Low-T..:

Schjølberg-Henriksen, Kari ; Malik, Nishant ; Gundersen, Elin Vold...
ECS Transactions. 64 (2014) 5 - p. 275-284 , 2014

Link: https://doi.org/10.1149/..

10

Leak Rates and Residual Gas Pressure in Cavities Sealed by ..:

Schjølberg-Henriksen, Kari ; Malik, Nishant ; Sandvand, Asmund..
ECS Transactions. 64 (2014) 5 - p. 305-314 , 2014

Link: https://doi.org/10.1149/..

11

Through Silicon Vias in MEMS packaging, a review:

Sordo, Guido ; Collini, Cristian ; Moe, Sigurd.
info:eu-repo/grantAgreement/EC/H2020/785337/. , 2021

Link: https://zenodo.org/recor..

12

Wafer bonding process for zero level vacuum packaging of ME..:

Sordo, Guido ; Collini, Cristian ; Moe, Sigurd..
info:eu-repo/grantAgreement/EC/H2020/785337/. , 2020

Link: https://zenodo.org/recor..

13

Electrical, Mechanical, and Hermetic Properties of Low-Temp..:

Schjølberg-Henriksen, Kari ; Malik, Nishant ; Gundersen, Elin Vold...
Norges forskningsråd: 210601. , 2015

Link: http://hdl.handle.net/11..

14

Electrical, Mechanical, and Hermetic Properties of Low-Temp..:

Schjølberg-Henriksen, Kari ; Malik, Nishant ; Gundersen, Elin Vold...
Norges forskningsråd: 210601. , 2015

Link: http://hdl.handle.net/11..

15

Electrical, Mechanical, and Hermetic Properties of Low-Temp..:

Schjølberg-Henriksen, Kari ; Malik, Nishant ; Gundersen, Elin Vold...
NFR/210601. , 2015

Link: http://hdl.handle.net/10..

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