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Mohan, Nihesh
5  Ergebnisse:
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1

Decomposition mechanism and morphological evolution of in s..:

Mohan, Nihesh ; Ahuir-Torres, Juan Ignacio ; Bhogaraju, Sri Krishna...
New Journal of Chemistry.  48 (2024)  15 - p. 6796-6808 , 2024
Link: https://doi.org/10.1039/..
 
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2

Novel Low Temperature and Low Pressure Sintering of ADAS Ra..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Bhogaraju, Sri Krishna ; Mohan, Nihesh ; Steinberger, Fabian... - p. 1-6 , 2023
Link: https://doi.org/10.23919..
 
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3

Rapid Sintering of Inkjet Printed Cu Complex Inks Using Las..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Mohan, Nihesh ; Ahuir-Torres, Juan Ignacio ; Bhogaraju, Sri Krishna.. - p. 1-7 , 2023
Link: https://doi.org/10.23919..
 
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4

Fluxfree solder paste and process for standard SMD componen..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Mohan, Nihesh ; Langer, Stefan ; Elger, Gordon - p. 163-168 , 2022
Link: https://doi.org/10.1109/..
 
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5

Copper sintering for microelectronics application:

Mohan, Nihesh ; Bhogaraju, Sri Krishna ; Saccon, Rodolfo.
https://opus4.kobv.de/opus4-haw-landshut/frontdoor/index/index/docId/368.  , 2022
Link: https://opus4.kobv.de/op..
 
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