E-LIB Suche - Ergebnisse für: Mokhtari, Omid

1

Identification of Beta-Sitosterol and Stigmasterol as Possi..:

Zamani, Pardis ; Mokhtari, Omid ; Dehghanian, Fariba
Precision Medicine and Clinical OMICS. 1 (2022) 1 - p. , 2022

Link: https://doi.org/10.5812/..

2

Formic acid and formate salts for chemical vapor deposition..:

Mokhtari, Omid ; Conti, Fosca ; Saccon, Rodolfo..
New Journal of Chemistry. 45 (2021) 43 - p. 20133-20139 , 2021

Link: https://doi.org/10.1039/..

3

Die-attach bonding for high temperature applications using ..:

Bhogaraju, Sri Krishna ; Mokhtari, Omid ; Conti, Fosca.
Scripta Materialia. 182 (2020) - p. 74-80 , 2020

Link: https://doi.org/10.1016/..

4

Effect of surface potential distribution on corrosion behav..:

Mokhtari, Omid ; Nishikawa, Hiroshi
Microelectronics Reliability. 113 (2020) - p. 113942 , 2020

Link: https://doi.org/10.1016/..

5

Effects of In Content on the Microstructure and Mechanical ..:

Jin, Sanghun ; Mokhtari, Omid ; Kanayama, Shutetsu.
Metals. 9 (2019) 5 - p. 548 , 2019

Link: https://doi.org/10.3390/..

6

Effects of Ti addition on the microstructure, mechanical pr..:

Zhou, Shiqi ; Yang, Chih-han ; Lin, Shih-kang...
Materials Science and Engineering: A. 744 (2019) - p. 560-569 , 2019

Link: https://doi.org/10.1016/..

7

Characterization of tin-oxides and tin-formate crystals obt..:

Mokhtari, Omid ; Conti, Fosca ; Bhogaraju, Sri Krishna...
New Journal of Chemistry. 43 (2019) 26 - p. 10227-10231 , 2019

Link: https://doi.org/10.1039/..

8

Microstructure and mechanical properties of Sn–1.0Ag–0.5Cu ..:

Leong, Y. M. ; Haseeb, A. S. M. A. ; Nishikawa, Hiroshi.
Journal of Materials Science: Materials in Electronics. 30 (2019) 13 - p. 11914-11922 , 2019

Link: https://doi.org/10.1007/..

9

Hybrid Cu particle paste with surface-modified particles fo..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),

Bhogaraju, Sri Krishna ; Mokhtari, Omid ; Pascucci, Jacopo... - p. 1-8 , 2019

Link: https://doi.org/10.23919..

10

A review: Formation of voids in solder joint during the tra..:

Mokhtari, Omid
Microelectronics Reliability. 98 (2019) - p. 95-105 , 2019

Link: https://doi.org/10.1016/..

11

Improvement in the mechanical properties of eutectic Sn58Bi..:

Zhou, Shiqi ; Mokhtari, Omid ; Rafique, Muhammad Ghufran...
Journal of Alloys and Compounds. 765 (2018) - p. 1243-1252 , 2018

Link: https://doi.org/10.1016/..

12

Formation of tin-based crystals from a SnAgCu alloy under f..:

Conti, Fosca ; Hanss, Alexander ; Mokhtari, Omid..
New Journal of Chemistry. 42 (2018) 23 - p. 19232-19236 , 2018

Link: https://doi.org/10.1039/..

13

Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-F..:

Guerrero, Jan-Ervin C. ; Camacho, Drexel H. ; Mokhtari, Omid.
International Journal of Corrosion. 2018 (2018) - p. 1-11 , 2018

Link: https://doi.org/10.1155/..

14

The shear strength of transient liquid phase bonded Sn–Bi s..:

Mokhtari, Omid ; Nishikawa, Hiroshi
Advanced Powder Technology. 27 (2016) 3 - p. 1000-1005 , 2016

Link: https://doi.org/10.1016/..

15

Correlation between microstructure and mechanical propertie..:

Mokhtari, Omid ; Nishikawa, Hiroshi
Materials Science and Engineering: A. 651 (2016) - p. 831-839 , 2016

Link: https://doi.org/10.1016/..