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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
3
Design, Process and Reliability of Face-up 2-layer molded F..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
5
A Compact Wafer-Level Heterogeneously Integrated Scalable O..:
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2024 IEEE Silicon Photonics Conference (SiPhotonics) ,
7
Direct-Drive 224 Gbps/λ PAM4 and 112 Gbps/λ NRZ Silicon Pho..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
12