Moo, Teck Lim
957  Ergebnisse:
Personensuche X
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3

Design, Process and Reliability of Face-up 2-layer molded F..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chong, Chai Tai ; Teck Guan, Lim ; Yong, Han... - p. 19-24 , 2020
 
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4

Osteogenic application of injectable gelatin-hyaluronan mat..:

Wanting, Niu ; Ding, Weng ; Abdulmonem, Alshihri...
Frontiers in Bioengineering and Biotechnology.  4 (2016)  - p. , 2016
 
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5

A Compact Wafer-Level Heterogeneously Integrated Scalable O..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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7

Direct-Drive 224 Gbps/λ PAM4 and 112 Gbps/λ NRZ Silicon Pho..:

, In: 2024 IEEE Silicon Photonics Conference (SiPhotonics),
 
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8

77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar Wit..:

Sun, Mei ; Guan Lim, Teck ; Soon Wee Ho, David...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  4 - p. 537-546 , 2024
 
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9

Superparamagnetic Fe3O4/In(OH)3 nanocomposite as a function..:

Chong, Chi Yan ; Ng, Hien Fuh ; Juan, Joon Ching...
Inorganic Chemistry Communications.  161 (2024)  - p. 111969 , 2024
 
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12

Characterization of 224 Gbps/lambda Interconnects in Co-Pac..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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