Morin, P.
4515  Ergebnisse:
Personensuche X
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1

Wafer-scale characterization for two-dimensional material l..:

Moussa, A. ; Bogdanowicz, J. ; Groven, B....
Japanese Journal of Applied Physics.  63 (2024)  3 - p. 030802 , 2024
 
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2

Navkite™ - Protection of inertial navigation system based o..:

, In: 2023 DGON Inertial Sensors and Systems (ISS),
Lenoble, A. ; Lenoir, Y. ; Chenilleau, J-A... - p. 1-17 , 2023
 
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5

Towards low damage and fab-compatible top-contacts in MX2 t..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Kundu, S. ; van Dorp, D. H. ; Schram, T.... - p. 1-2 , 2023
 
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7

Exploring manufacturability of novel 2D channel materials: ..:

, In: 2023 International Electron Devices Meeting (IEDM),
Dorow, C. J. ; Schram, T. ; Smets, Q.... - p. 1-4 , 2023
 
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9

Physica status solidi 

Volume 17, Number 2: June 16  Physica status solidi ; Volume 17, Number 2, A
Allen, J. W ; Arushanov, E. K ; Averkieva, G. K... - Reprint 2021 . , [2021]
 
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10

On MX2-based metal-oxide-semiconductor device capacitance-v..:

, In: 2021 Device Research Conference (DRC),
Lin, D. ; Wu, X. ; Mootheri, V.... - p. 1-2 , 2021
 
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11

Graphene Nanocoating: High Quality and Stability upon Sever..:

Rosa, V. ; Malhotra, R. ; Agarwalla, S.V....
Journal of Dental Research.  100 (2021)  10 - p. 1169-1177 , 2021
 
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12

Inhibiting Corrosion of Biomedical-Grade Ti-6Al-4V Alloys w..:

Malhotra, R. ; Han, Y.M. ; Morin, J.L.P....
Journal of Dental Research.  99 (2020)  3 - p. 285-292 , 2020
 
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13

Buried Power Rail Integration with Si FinFETs for CMOS Scal..:

, In: 2020 IEEE Symposium on VLSI Technology,
Gupta, A. ; Mertens, H. ; Tao, Z.... - p. 1-2 , 2020
 
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14

Scaled transistors with 2D materials from the 300mm fab:

, In: 2020 IEEE Silicon Nanoelectronics Workshop (SNW),
Asselberghs, I. ; Schram, T. ; Smets, Q.... - p. 67-68 , 2020
 
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15

Buried Power Rail Scaling and Metal Assessment for the 3 nm..:

, In: 2020 IEEE International Electron Devices Meeting (IEDM),
Gupta, A. ; Pedreira, O. Varela ; Tao, Z.... - p. 20.3.1-20.3.4 , 2020
 
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