Munir, Z.A.
560  Ergebnisse:
Personensuche X
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2

Fracture Resistance and Crack Growth Mechanisms in Function..:

Sahragard-Monfared, G. ; Smudde, C. M. ; Carpenter, R. D...
Metallurgical and Materials Transactions A.  54 (2023)  9 - p. 3594-3602 , 2023
 
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3

Contributors:

, In: Spark Plasma Sintering,
Ariane, M. ; Balima, F. ; Barthelemy, F.... - p. ix-xii , 2019
 
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5

Thermoelectric properties of Sc- and Y-doped Mg2Si prepared..:

Meng, Q.S. ; Fan, W.H. ; Chen, R.X..
Journal of Alloys and Compounds.  509 (2011)  30 - p. 7922-7926 , 2011
 
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6

Graded materials of (TiB2)pNi with nickel substrate prepare..:

Chen, Shaoping ; Meng, Qingsen ; Zhang, Nan..
Journal of Wuhan University of Technology-Mater. Sci. Ed..  25 (2010)  1 - p. 39-43 , 2010
 
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7

Thermoelectric properties of nanostructured FeSi2 prepared ..:

Meng, Q.S. ; Fan, W.H. ; Chen, R.X..
Journal of Alloys and Compounds.  492 (2010)  1-2 - p. 303-306 , 2010
 
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8

Titanium diboride–nickel graded materials prepared by field..:

Chen, Shao Ping ; Meng, Qing Sen ; Liu, W..
Journal of Materials Science.  44 (2009)  4 - p. 1121-1126 , 2009
 
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9

Synthesis and characterization of TiB2–Ni–Ni3Al–CrNi alloy ..:

Chen, S.P. ; Meng, Q.S. ; Zhao, J.F..
Journal of Alloys and Compounds.  476 (2009)  1-2 - p. 889-893 , 2009
 
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11

Characterization of alumina matrix nanocomposite with ZrO2 ..:

Trombini, V. ; Pallone, E.M.J.A. ; Anselmi-Tamburini, U...
Materials Science and Engineering: A.  501 (2009)  1-2 - p. 26-29 , 2009
 
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12

Thermal stability of FeAl intermetallics prepared by SHS si..:

Paris, S. ; Pighini, C. ; Gaffet, E...
International Journal of Self-Propagating High-Temperature Synthesis.  17 (2008)  3 - p. 183-188 , 2008
 
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13

Field-assisted diffusion bonding and bond characterization ..:

Liu, C. R. ; Zhao, J. F. ; Lu, X. Y....
Journal of Materials Science.  43 (2008)  15 - p. 5076-5082 , 2008
 
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14

Simultaneous synthesis and consolidation of nanostructured ..:

Park, Hyun-Kuk ; Shon, In-Jin ; Yoon, Jin-Kook...
Journal of Alloys and Compounds.  461 (2008)  1-2 - p. 560-564 , 2008
 
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