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2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) ,
1
Integrating 8nm Self-Aligned Tip-to-Tip to Enable 4-track S..:
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2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) ,
2
Improving uniformity of 3-level High Aspect Ratio Supervias:
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2022 International Electron Devices Meeting (IEDM) ,
3
Semi-damascene Integration of a 2-layer MOL VHV Scaling Boo..:
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2022 IEEE International Interconnect Technology Conference (IITC) ,
4
Reliability Evaluation of Semi-damascene Ru/Air-Gap interco..:
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2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
5
First demonstration of Two Metal Level Semi-damascene Inter..:
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2022 IEEE International Interconnect Technology Conference (IITC) ,
6
Integration of Al2O3 Etch Stop Layer in 21nm Pitch Dual-Dam..:
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2022 IEEE International Interconnect Technology Conference (IITC) ,
7
Enabling 3-level High Aspect Ratio Supervias for 3nm nodes ..:
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2021 IEEE International Reliability Physics Symposium (IRPS) ,
8
Reliability of a DME Ru Semidamascene scheme with 16 nm wid..:
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2021 IEEE International Electron Devices Meeting (IEDM) ,
9
Buried Power Rail Metal exploration towards the 1 nm Node:
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2020 IEEE International Electron Devices Meeting (IEDM) ,
11