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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Temperature dependent Dielectric Characterization of Low Lo..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
2
Wideband Antennas on Thin-Film Packaging Substrates for 140..:
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
3
High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer..:
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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
4
Mold based D-band slotted SIW bandpass filter:
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2020 50th European Microwave Conference (EuMC) ,
5
High Quality Integrated Inductor in Fan-out Wafer-Level Pac..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
6
A Novel Packaging and System-Integration Platform with Inte..:
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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
7
PCB Embedding Technology for 5G mmWave Applications:
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2020 IEEE 17th Annual Consumer Communications & Networking Conference (CCNC) ,
8
Intelligent and Adaptive Machine Learning-based Algorithm f..:
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2019 IEEE International Conference on Electronics, Computing and Communication Technologies (CONECCT) ,
9
Intelligent Concept of Optimal WiFi Mesh Router Placement f..:
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2024 International Conference on Communication, Computing and Internet of Things (IC3IoT) ,
10
Intelligent Automation in Long Vehicles through LDR Sensor ..:
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2023 Second International Conference on Electronics and Renewable Systems (ICEARS) ,
12
Design and Fabrication of Multi-functioned Seed Sowing Mach..:
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2023 IEEE International Conference on Consumer Electronics (ICCE) ,
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