Murugesan, Kavin Senthil
26  Ergebnisse:
Personensuche X
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1

Temperature dependent Dielectric Characterization of Low Lo..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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2

Wideband Antennas on Thin-Film Packaging Substrates for 140..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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3

High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
 
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4

Mold based D-band slotted SIW bandpass filter:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
 
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6

A Novel Packaging and System-Integration Platform with Inte..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
 
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7

PCB Embedding Technology for 5G mmWave Applications:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Kosmider, Stefan ; Loher, Thomas ; Ostmann, Andreas... - p. 603-609 , 2022
 
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8

Intelligent and Adaptive Machine Learning-based Algorithm f..:

, In: 2020 IEEE 17th Annual Consumer Communications & Networking Conference (CCNC),
 
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9

Intelligent Concept of Optimal WiFi Mesh Router Placement f..:

, In: 2019 IEEE International Conference on Electronics, Computing and Communication Technologies (CONECCT),
 
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10

Intelligent Automation in Long Vehicles through LDR Sensor ..:

, In: 2024 International Conference on Communication, Computing and Internet of Things (IC3IoT),
Jamuna, P ; Kavin Kumar, K ; Murugesan, A... - p. 1-6 , 2024
 
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12

Design and Fabrication of Multi-functioned Seed Sowing Mach..:

, In: 2023 Second International Conference on Electronics and Renewable Systems (ICEARS),
 
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14

Closed WiFi Hotspot - Truly Hidden Network:

, In: 2023 IEEE International Conference on Consumer Electronics (ICCE),
 
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