Murugesan, M.
~ 1300  Ergebnisse:
Personensuche X
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1

Implementation of an Effective Methodology to Avoid DDoS At..:

, In: 2024 International Conference on Intelligent and Innovative Technologies in Computing, Electrical and Electronics (IITCEE),
 
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2

Preparation and Electrochemical Investigation of NiO Hollow..:

Murugesan, M. ; Nagavenkatesh, K. R. ; Devendran, P....
Journal of Inorganic and Organometallic Polymers and Materials.  , 2024
 
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4

Review on the recent improvements in lanthanum ferrite pero..:

Nagavenkatesh, K.R. ; Sambathkumar, C. ; Murugesan, M....
Journal of Industrial and Engineering Chemistry.  136 (2024)  - p. 16-45 , 2024
 
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5

Trajectory-Driven Efficiency: An Energy-Efficient Opportuni..:

, In: 2024 10th International Conference on Communication and Signal Processing (ICCSP),
 
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8

Chip-to-Chip Hybrid Bonding with Larger-Oriented Cu Grains ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Murugesan, M. ; Sawa, M. ; Sone, E.... - p. 1713-1718 , 2023
 
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9

Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding:

, In: 2023 IEEE International 3D Systems Integration Conference (3DIC),
Murugesan, M. ; Sawa, M. ; Sone, E.... - p. 1-4 , 2023
 
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12

Physical Properties of Large Cu Grain and Application to Cu..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Kobayashi, R. ; Sone, E. ; Sawa, M... - p. 43-44 , 2023
 
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13

ATOMM: Enjoy and Experience the Music:

, In: 2023 International Conference on Research Methodologies in Knowledge Management, Artificial Intelligence and Telecommunication Engineering (RMKMATE),
 
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14

Cu-SiO2 Hybrid Bonding Yield Enhancement Through Cu Grain E..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Murugesan, M. ; Mori, K. ; Sawa, M.... - p. 685-690 , 2022
 
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