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Nawghane, Chinmay
8  Ergebnisse:
Personensuche X
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1

Effect of potting on the solder joint reliability of QFN pa..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Nawghane, Chinmay ; Vandevelde, Bart ; Vanderstraeten, Daniel.. - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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2

BGA electromigration behavior and why it has become the bot..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Labie, Riet ; Nawghane, Chinmay ; Tsiakos, Dimitrios... - p. 678-684 , 2024
Link: https://doi.org/10.1109/..
 
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3

A Hybrid Model for Prognostic and Health Management of Elec..:

Murgia, Alessandro ; Harsha, Chaitra ; Tsiporkova, Elena..
Electronics.  13 (2024)  3 - p. 642 , 2024
Link: https://doi.org/10.3390/..
 
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4

Deformation analysis of QFN packages for validation of ther..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Nawghane, Chinmay ; Moncond'Huy, Thomas ; Vandevelde, Bart.. - p. 1-8 , 2023
Link: https://doi.org/10.1109/..
 
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5

NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integr..:

, In: 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE),
Iturbe, Xabier ; Abderrahmane, Nassim ; Abella, Jaume... - p. 1-6 , 2023
Link: https://doi.org/10.23919..
 
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6

A PoF based methodology to assess the reliability of a sens..:

, In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Nawghane, Chinmay ; Vandevelde, Bart ; Labie, Riet... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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7

Exchanging Thermo-Mechanical Simulation Models independent ..:

, In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Vandevelde, Bart ; Nawghane, Chinmay ; Dudek, Rainer... - p. 1-7 , 2022
Link: https://doi.org/10.1109/..
 
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8

Challenges in introducing high-density interconnect technol..:

Cauwe, Maarten ; Vandevelde, Bart ; Nawghane, Chinmay...
CEAS Space Journal.  15 (2021)  1 - p. 101-112 , 2021
Link: https://doi.org/10.1007/..
 
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