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2023 30th International Conference on Mixed Design of Integrated Circuits and System (MIXDES) ,
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Temperature Power Factor Influence on the Operating Point o..:
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2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Influence of temperature on the quality of operation of an ..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
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Performance Analysis of the Analog Path of Read-Out Integra..:
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2022 29th International Conference on Mixed Design of Integrated Circuits and System (MIXDES) ,
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Comparison of Photovoltaics System Response with Constant a..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
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Analysis of temperature variation influence on damping coef..:
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2022 29th International Conference on Mixed Design of Integrated Circuits and System (MIXDES) ,
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Analysis of Photovoltaics Performance Under Variable Condit..:
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2022 29th International Conference on Mixed Design of Integrated Circuits and System (MIXDES) ,
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Observation of Readout Temperature Dependence and Its Varia..:
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2020 IEEE XVIth International Conference on the Perspective Technologies and Methods in MEMS Design (MEMSTECH) ,
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Capacitance Deviations for Deformed Parts of Solid MEMS Sen..:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Analysis of Temperature Variation Influence on Capacitance ..:
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2020 Baltic URSI Symposium (URSI) ,
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Estimation of Comb Structure Capacitance for MEMS Inertial ..:
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2020 36th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ,
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An Analysis of Temperature Variation Effect on Response and..:
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2020 Baltic URSI Symposium (URSI) ,
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