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Nedumthakady, Nithin
5  Ergebnisse:
Personensuche X
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1

Mitigating Cracking from RDL Stress in Glass Substrates wit..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Molina-Mangual, Christian ; Surillo, Emanuel Torres ; Nedumthakady, Nithin. - p. 1552-1557 , 2024
Link: https://doi.org/10.1109/..
 
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2

Magneto-Assisted Graphene Reinforcement: A New Method to En..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Nedumthakady, Nithin ; Bhaskar, Pragna ; Smet, Vanessa - p. 1135-1142 , 2023
Link: https://doi.org/10.1109/..
 
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3

Glass Panel Packaging, as the Most Leading-Edge Packaging: ..:

, In: 2020 Pan Pacific Microelectronics Symposium (Pan Pacific),
Tummala, Rao ; Deprospo, Bartlet ; Dwarakanath, Shreya... - p. 1-5 , 2020
Link: https://doi.org/10.23919..
 
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4

Packaging Approaches for mm Wave and Sub-THz Communication:

, In: 2019 IEEE MTT-S International Microwave Conference on Hardware and Systems for 5G and Beyond (IMC-5G),
Ravichandran, Siddharth ; Huang, Kai-Qi ; Rehman, Mutee ur... - p. 1-5 , 2019
Link: https://doi.org/10.1109/..
 
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5

Integrated Copper Heat Spreaders in Glass Panel Embedded Pa..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Nedumthakady, Nithin ; DeProspo, Bartlet ; Raj, P. Markondeya... - p. 2013-2018 , 2018
Link: https://doi.org/10.1109/..
 
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