E-LIB Suche - Ergebnisse für: Nguyen, Hoang-Vu.

1

Wafer Level Capping Technology for Vacuum Packaging of Micr..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Zoschke, Kai ; Manier, Charles Alix ; Oppermann, Hermann... - p. 1571-1578 , 2023

2

Ag–(In–Bi) solid-state bonding:

Kuziora, Stéphane Léonard ; Nguyen, Hoang-Vu ; Aasmundtveit, Knut Eilif
Journal of Materials Science: Materials in Electronics. 34 (2023) 16 - p. , 2023

Link: https://doi.org/10.1007/..

3

Flip-Chip Interconnects Based on Single Metal-Coated Polyme..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),

Huynh, Van Long ; Aasmundtveit, Knut E. ; Nguyen, Hoang-Vu - p. 1-5 , 2023

Link: https://doi.org/10.23919..

4

Thermal Conductivity and Mechanical Properties of Polymer C..:

Do, Nu Bich Duyen ; Imenes, Kristin ; Aasmundtveit, Knut E...
Polymers. 15 (2023) 6 - p. 1552 , 2023

Link: https://doi.org/10.3390/..

5

Black Silicon as Anti-Reflective Structure for Infrared Ima..:

Bardalen, Eivind ; Bouchouri, Angelos ; Akram, Muhammad Nadeem.
Nanomaterials. 14 (2023) 1 - p. 20 , 2023

Link: https://doi.org/10.3390/..

6

Investigate the Frequency Effect to the Deformation and Vib..:

, In: 2023 8th International Scientific Conference on Applying New Technology in Green Buildings (ATiGB),

Do, Chi-Phi ; Doan, Thanh-Bao ; Le, Dinh-Kha. - p. 136-141 , 2023

Link: https://doi.org/10.1109/..

7

Thermally Conductive Polymer Composites with Hexagonal Boro..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),

Duyen Do, Nu Bich ; Imenes, Kristin ; Aasmundtveit, Knut E... - p. 1-8 , 2023

Link: https://doi.org/10.23919..

8

Low-Temperature Cu–(Sn–Bi) Solid Liquid Interdiffusion Bond..:

, In: 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac),

Gonzalez, Lisette Hernandez ; Aasmundveit, Knut E. ; Nguyen, Hoang-Vu - p. 1-4 , 2023

Link: https://doi.org/10.23919..

9

Assembly of Ultra-Thin MEMS Device on Driver Chip Using Ani..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),

Nguyen, Hoang-Vu ; Aasmundtveit, Knut Eilif - p. 1-5 , 2023

Link: https://doi.org/10.23919..

10

Encapsulation of Biosensor for Stress Monitoring in Fish: A..:

, In: 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac),

Brathen, Hanna T. ; Barskrind, Steffen ; Kolstad, Anne Line Fredsvik.. - p. 1-5 , 2023

Link: https://doi.org/10.23919..

11

Au-(In-Bi) and Ag-(In-Bi) Metallic Bonding for Temperature ..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),

Nguyen, Hoang-Vu ; Kuziora, Stephane Leonard ; Aasmundtveit, Knut E. - p. 373-378 , 2022

Link: https://doi.org/10.1109/..

12

Selective Deposition of Conductive Particles for Anisotropi..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),

Huynh, Van Long ; Aasmundtveit, Knut Eilif ; Nguyen, Hoang-Vu - p. 124-128 , 2022

Link: https://doi.org/10.1109/..

13

Design of Silicon Cap for Hermetic Packaging of Microbolome..:

Xia, Hexin ; Akram, Muhammad Nadeem ; Roy, Avisek...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 12 (2022) 3 - p. 429-436 , 2022

Link: https://doi.org/10.1109/..

14

Vacuum Packaging of MEMS-based Infrared Detectors:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),

Roy, Avisek ; Nguyen, Hoang-Vu ; Xia, Hexin... - p. 410-415 , 2022

Link: https://doi.org/10.1109/..

15

Ag-(In-Bi) Solid–Liquid Interdiffusion Bonding:

Kuziora, Stéphane Léonard ; Nguyen, Hoang-Vu ; Aasmundtveit, Knut Eilif
Journal of Electronic Materials. 52 (2022) 2 - p. 1284-1294 , 2022

Link: https://doi.org/10.1007/..