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2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) ,
5
Vertical etching of Al0.7Sc0.3N for next generation of acou..:
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2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) ,
7
Dual-Frequency Piezoelectric Micromachined Ultrasonic Trans..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
10
Soft mask-based dry etching of parylene AF4 for advanced pa..:
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2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) ,
13