Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Nogita, Kanta
4  Ergebnisse:
Personensuche X
?
1

High Density RDL Interconnection of Die to Die using Chip-F..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Han, YoungGun ; Kanayama, Taka ; Mitsutomi, Hisamitsu.. - p. 61-62 , 2023
Link: https://doi.org/10.23919..
 
?
2

Development of High Reliability Process for Fine Cu Wiring ..:

Kanayama, Taka ; Sueyoshi, Haruki ; Nogita, Kanta.
Transactions of The Japan Institute of Electronics Packaging.  13 (2020)  0 - p. E20-005-1-E20-005-3 , 2020
Link: https://doi.org/10.5104/..
 
?
3

Comparison of metal oxide removal using hydrogen radicals g..:

Nogita, Kanta ; Kamatani, Ryosuke ; Tayumoto, Satoru.
Thin Solid Films.  575 (2015)  - p. 107-109 , 2015
Link: https://doi.org/10.1016/..
 
?
4

Evaluation of Residual Stress and Warpage of Device Embedde..:

Han, Younggun ; Horiuchi, Osamu ; Hayashi, Shigehiro...
Transactions of The Japan Institute of Electronics Packaging.  8 (2015)  1 - p. 81-94 , 2015
Link: https://doi.org/10.5104/..
 
1-4