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Nousiainen, O.
83  Ergebnisse:
Personensuche X
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1

Texture Evolution During Cold Forming of Rectangular Hollow..:

Kaijalainen, A ; Javaheri, V ; Nousiainen, O...
IOP Conference Series: Materials Science and Engineering.  1121 (2021)  1 - p. 012005 , 2021
Link: https://doi.org/10.1088/..
 
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2

Enhanced thermal fatigue endurance and lifetime prediction ..:

Nousiainen, O. ; Salmela, O. ; Putaala, J..
Soldering & Surface Mount Technology.  23 (2011)  2 - p. 104-114 , 2011
Link: https://doi.org/10.1108/..
 
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3

Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2...:

Nousiainen, O. ; Kangasvieri, T. ; Rautioaho, R..
Soldering & Surface Mount Technology.  23 (2011)  1 - p. 30-39 , 2011
Link: https://doi.org/10.1108/..
 
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4

Effect of ENIG deposition on the failure mechanisms of ther..:

Nousiainen, O. ; Kangasvieri, T. ; Kautio, K...
Soldering & Surface Mount Technology.  22 (2010)  3 - p. 22-35 , 2010
Link: https://doi.org/10.1108/..
 
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5

Characterization of Sn7In4.1Ag0.5Cu solder in lead‐free com..:

Nousiainen, O. ; Kangasvieri, T. ; Rautioaho, R..
Soldering & Surface Mount Technology.  20 (2008)  3 - p. 11-17 , 2008
Link: https://doi.org/10.1108/..
 
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6

Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu sph..:

Nousiainen, O. ; Lehtiniemi, L. ; Kangasvieri, T...
Microelectronics Reliability.  48 (2008)  4 - p. 622-630 , 2008
Link: https://doi.org/10.1016/..
 
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7

Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plas..:

NOUSIAINEN, O. ; PUTAALA, J. ; KANGASVIERI, T...
Journal of Electronic Materials.  36 (2007)  3 - p. 232-241 , 2007
Link: https://doi.org/10.1007/..
 
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8

Reliability and RF performance of BGA solder joints with pl..:

Kangasvieri, T. ; Nousiainen, O. ; Putaala, J...
Microelectronics Reliability.  46 (2006)  8 - p. 1335-1347 , 2006
Link: https://doi.org/10.1016/..
 
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9

Metallurgical reactions in composite 90Pb10Sn/lead-free sol..:

Nousiainen, O. ; Putaala, J. ; Kangasvieri, T...
Journal of Electronic Materials.  35 (2006)  10 - p. 1857-1865 , 2006
Link: https://doi.org/10.1007/..
 
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10

Thermal fatigue in solder joints of Ag-Pd and Ag-Pt metalli..:

Rautioaho, R. ; Nousiainen, O. ; Leppävuori, S...
Microelectronics Reliability.  41 (2001)  9-10 - p. 1643-1648 , 2001
Link: https://doi.org/10.1016/..
 
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11

Thermal fatigue and metallurgical reactions in solder joint..:

Rautioaho, R. ; Nousiainen, O. ; Saven, T...
Microelectronics Reliability.  40 (2000)  8-10 - p. 1527-1532 , 2000
Link: https://doi.org/10.1016/..
 
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12

Bioremediation strategies for removal of residual atrazine ..:

Nousiainen, Aura O. ; Björklöf, Katarina ; Sagarkar, Sneha...
Applied Microbiology and Biotechnology.  99 (2015)  23 - p. 10249-10259 , 2015
Link: https://doi.org/10.1007/..
 
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13

Atrazine degradation in boreal nonagricultural subsoil and ..:

Nousiainen, Aura O. ; Björklöf, Katarina ; Sagarkar, Sneha...
Journal of Soils and Sediments.  14 (2014)  6 - p. 1179-1188 , 2014
Link: https://doi.org/10.1007/..
 
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14

Mice Deficient in Transmembrane Prostatic Acid Phosphatase ..:

Nousiainen, Heidi O. ; Quintero, Ileana B. ; Myöhänen, Timo T....
PLoS ONE.  9 (2014)  5 - p. e97851 , 2014
Link: https://doi.org/10.1371/..
 
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15

Mutations in mRNA export mediator GLE1 result in a fetal mo..:

Nousiainen, Heidi O ; Kestilä, Marjo ; Pakkasjärvi, Niklas...
Nature Genetics.  40 (2008)  2 - p. 155-157 , 2008
Link: https://doi.org/10.1038/..
 
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