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Nousiainen, O. (Olli)
63  Ergebnisse:
Personensuche X
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1

Precipitation behavior of novel 1 GPa ferritic advanced hig..:

Nousiainen, O. (Olli) ; Hannula, J. (Jaakko) ; Saukko, S. (Sami).. , 2023
Link: http://urn.fi/urn:nbn:fi..
 
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2

Evaluation of strengthening mechanisms in novel fully ferri..:

Nousiainen, O. (Olli) ; Hannula, J. (Jaakko) ; Saukko, S. (Sami).. , 2023
Link: http://urn.fi/urn:nbn:fi..
 
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3

Eddy current soldering of solar cell ribbons under a layer ..:

Moazami Goodarzi, D. (Dara) ; Lauri, J. (Janne) ; Putaala, J. (Jussi).. , 2023
Link: http://urn.fi/urn:nbn:fi..
 
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4

Mechanical properties of welded ultrahigh-strength S960 ste..:

Keränen, L. (Lassi) ; Nousiainen, O. (Olli) ; Javaheri, V. (Vahid)... , 2022
Link: http://urn.fi/urn:nbn:fi..
 
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5

Effect of voids on thermomechanical cracking in lead-free S..:

Hagberg, J. (Juha) ; Nousiainen, O. (Olli) ; Putaala, J. (Jussi)... , 2020
Link: http://urn.fi/urn:nbn:fi..
 
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6

Power module interconnection reliability in BTS application:

Putaala, J. (Jussi) ; Hagberg, J. (Juha) ; Kangasvieri, T. (Tero)... , 2019
Link: http://urn.fi/urn:nbn:fi..
 
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7

Characterization of second-level lead-free BGA interconnect..:

Nousiainen, O. (Olli)
info:eu-repo/semantics/altIdentifier/pissn/0355-3213.  , 2010
Link: http://urn.fi/urn:isbn:9..
 
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8

Cytokine data obtained from synovial stromal cells of patie..:

Huhtakangas, J. A. (Johanna A.) ; Veijola, J. (Johanna) ; Turunen, S. (Sanna)...
info:eu-repo/semantics/altIdentifier/eissn/2352-3409.  , 2017
Link: http://urn.fi/urn:nbn:fi..
 
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9

Texture Evolution During Cold Forming of Rectangular Hollow..:

Kaijalainen, A ; Javaheri, V ; Nousiainen, O...
IOP Conference Series: Materials Science and Engineering.  1121 (2021)  1 - p. 012005 , 2021
Link: https://doi.org/10.1088/..
 
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10

Enhanced thermal fatigue endurance and lifetime prediction ..:

Nousiainen, O. ; Salmela, O. ; Putaala, J..
Soldering & Surface Mount Technology.  23 (2011)  2 - p. 104-114 , 2011
Link: https://doi.org/10.1108/..
 
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11

Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2...:

Nousiainen, O. ; Kangasvieri, T. ; Rautioaho, R..
Soldering & Surface Mount Technology.  23 (2011)  1 - p. 30-39 , 2011
Link: https://doi.org/10.1108/..
 
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12

Effect of ENIG deposition on the failure mechanisms of ther..:

Nousiainen, O. ; Kangasvieri, T. ; Kautio, K...
Soldering & Surface Mount Technology.  22 (2010)  3 - p. 22-35 , 2010
Link: https://doi.org/10.1108/..
 
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13

Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu sph..:

Nousiainen, O. ; Lehtiniemi, L. ; Kangasvieri, T...
Microelectronics Reliability.  48 (2008)  4 - p. 622-630 , 2008
Link: https://doi.org/10.1016/..
 
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14

Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plas..:

NOUSIAINEN, O. ; PUTAALA, J. ; KANGASVIERI, T...
Journal of Electronic Materials.  36 (2007)  3 - p. 232-241 , 2007
Link: https://doi.org/10.1007/..
 
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15

Reliability and RF performance of BGA solder joints with pl..:

Kangasvieri, T. ; Nousiainen, O. ; Putaala, J...
Microelectronics Reliability.  46 (2006)  8 - p. 1335-1347 , 2006
Link: https://doi.org/10.1016/..
 
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