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How to Manipulate Warpage in Fan-out Wafer and Panel Level ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Braun, Tanja ; Holck, Ole ; Adler, Marius... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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A Closer Look to Fan-out Panel Level Packaging:

, In: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Braun, Tanja ; Holck, Ole ; Voitel, Marcus... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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Panel Level Packaging – Where are the Technology Limits?:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Braun, Tanja ; Holck, Ole ; Obst, Mattis... - p. 807-818 , 2022
Link: https://doi.org/10.1109/..
 
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Packaging Platform for low to medium Power Packages:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Thomas, Tina ; Nguyen, Thanh Duy ; Blechert, Martin... - p. 39-44 , 2022
Link: https://doi.org/10.1109/..
 
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