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Proceedings of the 55th ACM Technical Symposium on Computer Science Education V. 2 ,
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Motivating and Increasing the Relevance of Elementary Compu..:
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2024 International Conference on Electronics Packaging (ICEP) ,
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Development of a Sintering Paste Using Cu@Ag Powder for Pow..:
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2024 International Conference on Electronics Packaging (ICEP) ,
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Thermal Cycle Reliability of BGA Package With Board-Level U..:
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2024 International Conference on Electronics Packaging (ICEP) ,
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