Oh, Diana Dajung
27  Ergebnisse:
Personensuche X
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1

Motivating and Increasing the Relevance of Elementary Compu..:

, In: Proceedings of the 55th ACM Technical Symposium on Computer Science Education V. 2,
 
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7

Development of a Sintering Paste Using Cu@Ag Powder for Pow..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Won, Mi So ; Kim, Dajung ; Yang, Hyunseung. - p. 327-328 , 2024
 
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8

Thermal Cycle Reliability of BGA Package With Board-Level U..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Park, Jiyeon ; Kim, Dajung ; Yang, Hyunseung.. - p. 1-2 , 2024
 
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9

Long-Term Reliability of Sintering Paste Using Ag Coated Cu..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Kim, Dajung ; Won, Mi so ; Yang, Hyunseung.. - p. 325-326 , 2024
 
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13

Underfill material property dependence of lifetime and mech..:

Kim, Dajung ; Park, Jiyeon ; Jang, Jeongki...
Microelectronics Reliability.  150 (2023)  - p. 115113 , 2023
 
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14

A Study on the Status and Genetic Characteristics of Carbap..:

Lee, Chan-mi ; Kim, Kyung-A ; Oh, Sang-Heon...
Korean Journal of Healthcare-Associated Infection Control and Prevention.  28 (2023)  2 - p. 226-232 , 2023
 
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15

Understanding the molecular recognition of Bacteroides frag..:

Thirunavukkarasu, Praveena ; Oh, Sungwhan F. ; Song, Heebum...
Acta Crystallographica Section A Foundations and Advances.  79 (2023)  a2 - p. C957-C957 , 2023
 
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