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Okoro, Chukwudi A
85  Ergebnisse:
Personensuche X
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1

Ultra Low-Loss Ion-Exchange Waveguides in Optimized Alkali ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Brusberg, Lars ; Dejneka, Matthew J. ; Okoro, Chukwudi A.... - p. 85-89 , 2024
Link: https://doi.org/10.1109/..
 
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2

Adhesion Layer Influence on Thermomechanical Reliability of..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Yang, Junbo ; Pan, Ke ; Yin, Pengcheng... - p. 1820-1825 , 2024
Link: https://doi.org/10.1109/..
 
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3

High-Temperature Constitutive Behavior of Electroplated Cop..:

Pan, Ke ; Yang, Junbo ; Lai, Yangyang...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  11 - p. 1861-1867 , 2023
Link: https://doi.org/10.1109/..
 
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4

In-situ temperature-dependent characterization of copper th..:

Pan, Ke ; Xu, Jiefeng ; Lai, Yangyang...
Microelectronics Reliability.  129 (2022)  - p. 114487 , 2022
Link: https://doi.org/10.1016/..
 
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5

(Invited) Towards the Physical Reliability of 3D-Integrated..:

Amoah, Papa K. ; Sunday, Christopher E ; Okoro, Chukwudi...
ECS Transactions.  109 (2022)  2 - p. 41-49 , 2022
Link: https://doi.org/10.1149/..
 
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6

20‐2: Integration of Through Glass Via Interconnects within..:

Garner, Sean ; Vaddi, Rajesh ; Kanungo, Mandakini...
SID Symposium Digest of Technical Papers.  53 (2022)  1 - p. 218-220 , 2022
Link: https://doi.org/10.1002/..
 
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7

Evaluation of the helium hermeticity reliability of copper ..:

Okoro, Chukwudi ; Maurey, Pamela ; Davis, Ronald.
Microelectronics Reliability.  137 (2022)  - p. 114783 , 2022
Link: https://doi.org/10.1016/..
 
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8

A comparative study of the thermomechanical reliability of ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Pan, Ke ; Okoro, Chukwudi ; Lai, Yangyang... - p. 1211-1217 , 2022
Link: https://doi.org/10.1109/..
 
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9

Understanding and eliminating thermo-mechanically induced r..:

Okoro, Chukwudi ; Jayaraman, Shrisudersan ; Pollard, Scott
Microelectronics Reliability.  120 (2021)  - p. 114092 , 2021
Link: https://doi.org/10.1016/..
 
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10

The interfacial reliability of through-glass vias for 2.5D ..:

Ahmed, Omar ; Jalilvand, Golareh ; Pollard, Scott..
Microelectronics International.  37 (2020)  4 - p. 181-188 , 2020
Link: https://doi.org/10.1108/..
 
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11

The effect of materials and design on the reliability of th..:

Ahmed, Omar ; Okoro, Chukwudi ; Pollard, Scott.
Multidiscipline Modeling in Materials and Structures.  17 (2020)  2 - p. 451-464 , 2020
Link: https://doi.org/10.1108/..
 
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12

The Impact of Organic Additives on Copper Trench Microstruc..:

Marro, James B. ; Okoro, Chukwudi A. ; Obeng, Yaw S..
Journal of The Electrochemical Society.  164 (2017)  9 - p. D543-D550 , 2017
Link: https://doi.org/10.1149/..
 
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13

The influence of pulse plating frequency and duty cycle on ..:

Marro, James B. ; Darroudi, Taghi ; Okoro, Chukwudi A...
Thin Solid Films.  621 (2017)  - p. 91-97 , 2017
Link: https://doi.org/10.1016/..
 
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14

Broadband Spectroscopic Characterization of Hybrid Low-k Di..:

Obeng, Yaw S. ; Okoro, Chukwudi A. ; Montgomery, Karl R....
ECS Transactions.  75 (2016)  5 - p. 199-206 , 2016
Link: https://doi.org/10.1149/..
 
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15

Towards Understanding Early Failures Behavior during Device..:

Obeng, Yaw S. ; Okoro, Chukwudi A. ; Amoah, Papa K...
ECS Journal of Solid State Science and Technology.  5 (2016)  9 - p. N61-N66 , 2016
Link: https://doi.org/10.1149/..
 
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