Personensuche
X
?
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Key Technologies and Design Aspects for Wafer Level Packagi..:
, In:
?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
2
Wafer Level Capping Technology for Vacuum Packaging of Micr..:
, In:
?
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
3
High Density Thin Film Flex Technology for Advanced Packagi..:
, In:
?
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
4
Fabrication and Characterization of Nanoporous Gold (NPG) I..:
, In:
?
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
9