Oppermann, Hermann
78  Ergebnisse:
Personensuche X
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1

Key Technologies and Design Aspects for Wafer Level Packagi..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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2

Wafer Level Capping Technology for Vacuum Packaging of Micr..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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3

High Density Thin Film Flex Technology for Advanced Packagi..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Zoschke, Kai ; Oppermann, Hermann ; Wohrmann, Markus... - p. 1010-1018 , 2022
 
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4

Fabrication and Characterization of Nanoporous Gold (NPG) I..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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9

Cap Fabrication and Transfer Bonding Technology for Hermeti..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Zoschke, Kai ; Mackowiak, Piotr ; Krohnert, Kevin... - p. 432-438 , 2020
 
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