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Orii, Yasumitsu
20  Ergebnisse:
Personensuche X
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1

Semiconductor Packaging Revolution in the Era of Chiplets:

, In: 2023 International Conference on IC Design and Technology (ICICDT),
Orii, Yasumitsu - p. ix-ix , 2023
Link: https://doi.org/10.1109/..
 
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2

Semiconductor Packaging Revolution in the Era of Chiplets :..:

, In: 2023 IEEE International Test Conference in Asia (ITC-Asia),
Orii, Yasumitsu - p. 1-1 , 2023
Link: https://doi.org/10.1109/..
 
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3

Temperature Dependence of Current-Voltage Characteristics o..:

, In: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Kobayashi, Masakazu ; Orii, Yasumitsu ; Shima, Hisashi... - p. 282-284 , 2022
Link: https://doi.org/10.1109/..
 
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4

Temperature Driven Current–Voltage Characteristics of Ionic..:

Kobayashi, Masakazu ; Orii, Yasumitsu ; Shima, Hisashi...
IEEE Journal of the Electron Devices Society.  10 (2022)  - p. 893-897 , 2022
Link: https://doi.org/10.1109/..
 
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5

Development of Materials Informatics Platform:

Orii, Yasumitsu ; Hirose, Shuichi ; Fujita, Akihiro.
Journal of Photopolymer Science and Technology.  34 (2021)  1 - p. 41-47 , 2021
Link: https://doi.org/10.2494/..
 
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6

Combining an Integrated Sensor Array with Machine Learning ..:

Gabrieli, Gianmarco ; Hu, Rui ; Matsumoto, Keiji...
Analytical Chemistry.  93 (2021)  50 - p. 16853-16861 , 2021
Link: https://doi.org/10.1021/..
 
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7

Development of Materials Informatics Platform:

, In: 2020 Pan Pacific Microelectronics Symposium (Pan Pacific),
Orii, Yasumitsu ; Hirose, Shuichi ; Toda, Hiroki. - p. 1-5 , 2020
Link: https://doi.org/10.23919..
 
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8

Molecular Inverse-Design Platform for Material Industries:

, In: Proceedings of the 26th ACM SIGKDD International Conference on Knowledge Discovery & Data Mining,
Takeda, Seiji ; Hama, Toshiyuki ; Hsu, Hsiang-Han... - p. 2961-2969 , 2020
Link: https://dl.acm.org/doi/1..
 
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9

Development of Liquid Photoresist for IMS (Injection Molded..:

Mukawa, Jun ; Takahashi, Seiichirou ; Kobata, Chihiro...
Journal of Photopolymer Science and Technology.  29 (2016)  3 - p. 395-402 , 2016
Link: https://doi.org/10.2494/..
 
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10

Peripheral Flip Chip Interconnection on Au Plated Pads usin..:

Noma, Hirokazu ; Toriyama, Kazushige ; Okamoto, Keishi...
Transactions of The Japan Institute of Electronics Packaging.  4 (2011)  1 - p. 95-100 , 2011
Link: https://doi.org/10.5104/..
 
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11

Micro Structure Observation and Reliability Behavior of Per..:

Orii, Yasumitsu ; Toriyama, Kazushige ; Kohara, Sayuri...
Transactions of The Japan Institute of Electronics Packaging.  4 (2011)  1 - p. 73-86 , 2011
Link: https://doi.org/10.5104/..
 
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12

Development of vacuum underfill technology for a 3D chip st..:

Sakuma, Katsuyuki ; Kohara, Sayuri ; Sueoka, Kuniaki...
Journal of Micromechanics and Microengineering.  21 (2011)  3 - p. 035024 , 2011
Link: https://doi.org/10.1088/..
 
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13

Wettability and Reliability for Double-Sided Assembly with ..:

Noma, Hirokazu ; Oyama, Yukifumi ; Nishiwaki, Hidetoshi...
Transactions of The Japan Institute of Electronics Packaging.  2 (2009)  1 - p. 85-90 , 2009
Link: https://doi.org/10.5104/..
 
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14

Solder joint reliability evaluation of chip scale package u..:

Shohji, Ikuo ; Mori, Hideo ; Orii, Yasumitsu
Microelectronics Reliability.  44 (2004)  2 - p. 269-274 , 2004
Link: https://doi.org/10.1016/..
 
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15

Combining an Integrated Sensor Array with Machine Learning ..:

Gabrieli, Gianmarco ; Hu, Rui ; Matsumoto, Keiji...
info:eu-repo/grantAgreement/EC/H2020/862882/.  , 2021
Link: https://zenodo.org/recor..
 
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