Oshida, H.
44  Ergebnisse:
Personensuche X
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1

Approach for Advanced Packaging for 2.5D/3D Chiplets:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Kubota, T. ; Oshida, H. ; Hayashiguchi, S.. - p. 177-178 , 2024
 
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2

Same size mold chase technology for effective stack die arc..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Deb, N. ; Tomita, Y. ; Brun, X. F.... - p. 29-33 , 2023
 
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3

Ultra-thin mold cap for Advanced Packaging Technology:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Deb, N. ; Brun, X. F. ; Masuyama, C.... - p. 43-49 , 2022
 
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4

Rates of reactions catalysed by a dimeric enzyme. Effects o..:

Ishikawa, H ; Ogino, H ; Oshida, H
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC1130610.  , 1991
 
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5

Drug coated balloon treatment with or without long inflatio..:

Fujiwara, Y ; Ueda, H ; Nishida, Y...
European Heart Journal.  44 (2023)  Supplement_2 - p. , 2023
 
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6

Twenty-Four Months' Resistance and Endurance Training Impro..:

Yoshiko, Akito ; Kaji, T. ; Sugiyama, H....
The Journal of nutrition, health and aging.  23 (2019)  6 - p. 564-570 , 2019
 
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11

Present situation of exercise therapy for patients with dia..:

Sato, Y. ; Kondo, K. ; Watanabe, T....
Diabetology International.  3 (2012)  2 - p. 86-91 , 2012
 
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