E-LIB Suche - Ergebnisse für: Ousten, Y.

1

Highlighting two integration technologies based on vias: Th..:

Balmont, M. ; Bord Majek, I. ; Poupard, B...
Microelectronics Reliability. 88-90 (2018) - p. 1108-1112 , 2018

Link: https://doi.org/10.1016/..

2

Inorganic/organic nanocomposites: Reaching a high filler co..:

Benhadjala, W. ; Gravoueille, M. ; Bord-Majek, I....
Applied Physics Letters. 107 (2015) 21 - p. , 2015

Link: https://doi.org/10.1063/..

3

High-power diode laser bars and shear strain:

Cassidy, Daniel T. ; Rehioui, O. ; Hall, Chadwick K....
Optics Letters. 38 (2013) 10 - p. 1633 , 2013

Link: https://doi.org/10.1364/..

4

Improved performances of polymer-based dielectric by using ..:

Benhadjala, W. ; Bord-Majek, I. ; Béchou, L....
Applied Physics Letters. 101 (2012) 14 - p. , 2012

Link: https://doi.org/10.1063/..

5

An original DoE-based tool for silicon photodetectors EoL e..:

Spezzigu, P. ; Bechou, L. ; Quadri, G....
Microelectronics Reliability. 51 (2011) 9-11 - p. 1999-2003 , 2011

Link: https://doi.org/10.1016/..

6

Effects of silicone coating degradation on GaN MQW LEDs per..:

Baillot, R. ; Deshayes, Y. ; Bechou, L....
Microelectronics Reliability. 50 (2010) 9-11 - p. 1568-1573 , 2010

Link: https://doi.org/10.1016/..

7

Selective activation of failure mechanisms in packaged doub..:

Deshayes, Y. ; Bord, I. ; Barreau, G....
Microelectronics Reliability. 48 (2008) 8-9 - p. 1354-1360 , 2008

Link: https://doi.org/10.1016/..

8

Reliability investigations of 850 nm silicon photodiodes un..:

Bourqui, M.L. ; Béchou, L. ; Gilard, O....
Microelectronics Reliability. 48 (2008) 8-9 - p. 1202-1207 , 2008

Link: https://doi.org/10.1016/..

9

Measurement of the thermal characteristics of packaged doub..:

Bechou, L. ; Rehioui, O. ; Deshayes, Y....
Optics & Laser Technology. 40 (2008) 4 - p. 589-601 , 2008

Link: https://doi.org/10.1016/..

10

Defect detection in multilayer ceramic capacitors:

Krieger, V. ; Wondrak, W. ; Dehbi, A....
Microelectronics Reliability. 46 (2006) 9-11 - p. 1926-1931 , 2006

Link: https://doi.org/10.1016/..

11

Failure mechanisms and qualification testing of passive com..:

Post, H.A. ; Letullier, P. ; Briolat, T....
Microelectronics Reliability. 45 (2005) 9-11 - p. 1626-1632 , 2005

Link: https://doi.org/10.1016/..

12

Vibration lifetime modelling of PCB assemblies using steinb..:

Dehbi, A. ; Ousten, Y. ; Danto, Y..
Microelectronics Reliability. 45 (2005) 9-11 - p. 1658-1661 , 2005

Link: https://doi.org/10.1016/..

13

Application of Picosecond Ultrasonics to Non-Destructive An..:

Andriamonje, G. ; Pouget, V. ; Ousten, Y....
Microelectronics Reliability. 43 (2003) 9-11 - p. 1803-1807 , 2003

Link: https://doi.org/10.1016/..

14

Detection and location of defects in electronic devices by ..:

Angrisani, L. ; Bechou, L. ; Dallet, D...
Measurement. 31 (2002) 2 - p. 77-91 , 2002

Link: https://doi.org/10.1016/..

15

High temperature reliability testing of aluminum and tantal..:

Dehbi, A. ; Wondrak, W. ; Ousten, Y..
Microelectronics Reliability. 42 (2002) 6 - p. 835-840 , 2002

Link: https://doi.org/10.1016/..