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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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Fan-out Wafer-level Packaging Process Integration for Artif..:
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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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Pre-fabricated High-density TSV Interposer for Programmable..:
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2022 International Conference on Electronics Packaging (ICEP) ,
3
Evaluation on Process-induced Warpage of Novel Fan-Out Wafe..:
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2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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Evaluation of Laser Releasable Temporary Bonding Adhesives ..:
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2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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