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X
Paniez, P.J.
28  Ergebnisse:
Personensuche X
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1

Physical and chemical analysis of advanced interconnections..:

Pantel, R ; Torres, J ; Paniez, P.
Microelectronic Engineering.  50 (2000)  1-4 - p. 277-284 , 2000
Link: https://doi.org/10.1016/..
 
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2

Improvement of Post-Exposure Delay Stability in Alicyclic A..:

Yamachika, Mikio ; Patterson, Kyle ; Cho, Sungseo...
Journal of Photopolymer Science and Technology.  12 (1999)  4 - p. 553-560 , 1999
Link: https://doi.org/10.2494/..
 
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3

Properties and mutual interactions of various acrylate mono..:

Paniez, P.J. ; Perrier, F. ; Panabiere, M...
Microelectronic Engineering.  46 (1999)  1-4 - p. 393-396 , 1999
Link: https://doi.org/10.1016/..
 
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4

Extensive thermal characterization of advanced resists by M..:

Paniez, P.J. ; Guinot, J-A. ; Mortini, B..
Microelectronic Engineering.  41-42 (1998)  - p. 367-370 , 1998
Link: https://doi.org/10.1016/..
 
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5

Bottom Anti-Reflective Coatings for DUV lithography: Determ..:

Schiltz, A. ; Terpan, J-F. ; Amblard, G..
Microelectronic Engineering.  35 (1997)  1-4 - p. 221-224 , 1997
Link: https://doi.org/10.1016/..
 
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6

Free volume effects in chemically amplified DUV positive re..:

Pain, L. ; Le Cornec, C. ; Rosilio, C..
Microelectronic Engineering.  30 (1996)  1-4 - p. 271-274 , 1996
Link: https://doi.org/10.1016/..
 
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7

Micropatterning for Advanced Interconnections:

VINET, F. ; PANIEZ, P. J.
Journal of Photopolymer Science and Technology.  9 (1996)  4 - p. 541-551 , 1996
Link: https://doi.org/10.2494/..
 
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8

Bottom anti-reflective coatings: Control of thermal process..:

Schiltz, A. ; Terpan, J-F. ; Brun, S..
Microelectronic Engineering.  30 (1996)  1-4 - p. 283-286 , 1996
Link: https://doi.org/10.1016/..
 
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9

Application of contact angle measurements to lithographic p..:

Fadda, E. ; Clarisse, C. ; Paniez, P.J.
Microelectronic Engineering.  30 (1996)  1-4 - p. 593-596 , 1996
Link: https://doi.org/10.1016/..
 
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10

In-situ determination of photoresist glass transition tempe..:

Schiltz, A. ; Paniez, P.J.
Microelectronic Engineering.  27 (1995)  1-4 - p. 413-416 , 1995
Link: https://doi.org/10.1016/..
 
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11

Temperature Effects in the Dry Etching Step of a Silylation..:

Joubert, O. ; Pons, M. ; Weill, A..
Journal of The Electrochemical Society.  140 (1993)  3 - p. L46-L49 , 1993
Link: https://doi.org/10.1149/..
 
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12

Melt flow of the silylated areas during the desire process:

Weill, A. ; Joubert, O. ; Paniez, P....
Microelectronic Engineering.  21 (1993)  1-4 - p. 251-254 , 1993
Link: https://doi.org/10.1016/..
 
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13

Acidity of lithographic materials: Characterization by colo..:

Paniez, P.J. ; Demattei, D.C. ; Abadie, M.J.M.
Microelectronic Engineering.  17 (1992)  1-4 - p. 279-282 , 1992
Link: https://doi.org/10.1016/..
 
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14

Etching of polymers by oxygen plasmas: Influence of viscoel..:

Joubert, O. ; Paniez, P. ; Pelletier, J..
Applied Physics Letters.  58 (1991)  9 - p. 959-961 , 1991
Link: https://doi.org/10.1063/..
 
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15

Polymer behavior under plasma etching:  Influence of physic..:

Joubert, O. ; Paniez, P. ; Pons, M..
Journal of Applied Physics.  70 (1991)  2 - p. 977-982 , 1991
Link: https://doi.org/10.1063/..
 
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