Panth, Shreepad
9  Ergebnisse:
Personensuche X
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1

Tier-partitioning for power delivery vs cooling tradeoff in..:

, In: Proceedings of the 52nd Annual Design Automation Conference,
Panth, Shreepad ; Samadi, Kambiz ; Du, Yang. - p. 1-6 , 2015
 
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2

Three-Tier 3D ICs for More Power Reduction : Strategies ..:

, In: Proceedings of the IEEE/ACM International Conference on Computer-Aided Design,
Song, Taigon ; Panth, Shreepad ; Chae, Yoo-Jin. - p. 752-757 , 2015
 
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4

Scan Test of Die Logic in 3-D ICs Using TSV Probing:

Noia, Brandon ; Panth, Shreepad ; Chakrabarty, Krishnendu.
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  23 (2015)  2 - p. 317-330 , 2015
 
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5

Power-Performance Study of Block-Level Monolithic 3D-ICs Co..:

, In: Proceedings of the 51st Annual Design Automation Conference,
Panth, Shreepad ; Samadi, Kambiz ; Du, Yang. - p. 1-6 , 2014
 
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6

Fast and Accurate Thermal Modeling and Optimization for Mon..:

, In: Proceedings of the 51st Annual Design Automation Conference,
 
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7

Placement-driven partitioning for congestion mitigation in ..:

, In: Proceedings of the 2014 on International symposium on physical design,
Panth, Shreepad ; Samadi, Kambiz ; Du, Yang. - p. 47-54 , 2014
 
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8

Design and CAD methodologies for low power gate-level monol..:

, In: Proceedings of the 2014 international symposium on Low power electronics and design,
Panth, Shreepad A. ; Samadi, Kambiz ; Du, Yang. - p. 171-176 , 2014
 
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9

IsoNet: Hardware-Based Job Queue Management for Many-Core A..:

Lee, Junghee ; Nicopoulos, Chrysostomos ; Lee, Hyung Gyu...
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  21 (2013)  6 - p. 1080-1093 , 2013
 
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