E-LIB Suche - Ergebnisse für: Park, Young-Bae

1

Effects of Dielectric Curing Temperature on the Interfacial..:

Kim, Gahui ; Son, Kirak ; Kim, Young-Cheon.
Electronic Materials Letters. 20 (2024) 4 - p. 393-401 , 2024

Link: https://doi.org/10.1007/..

2

Structural, Optical, Electrical, and Nanomechanical Propert..:

Kim, Jaewon ; Kim, Gahui ; Park, Young-Bae
Electronic Materials Letters. 20 (2024) 4 - p. 402-413 , 2024

Link: https://doi.org/10.1007/..

3

Solid-State Bonding with SAC305 Sheets for Direct Cooling:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Jo, Eunjin ; Kim, YehRi ; Park, Young-Bae. - p. 147-148 , 2024

Link: https://doi.org/10.23919..

4

Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni..:

Han, Seonghui ; Han, Sang-Eun ; Lee, Tae-Young...
Materials. 17 (2024) 14 - p. 3619 , 2024

Link: https://doi.org/10.3390/..

5

Identification of cell-biologic mechanisms of coronary arte..:

Yang, Han-Mo ; Lee, Joo-Eun ; Kim, Ju-Young...
Biomaterials Research. 27 (2023) 1 - p. , 2023

Link: https://doi.org/10.1186/..

6

The Formation of Ru/ZnO Multifunctional Bilayer through Are..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),

Mori, Yuki ; Cheon, Taehoon ; Kotsugi, Yohei... - p. 1-3 , 2023

Link: https://doi.org/10.1109/..

7

Joint reliability of Al wire bonding on OSP and ENIG surfac..:

Ahn, Byeongjin ; Kim, Jahyeon ; Cheon, Gyeong-Yeong...
Journal of Materials Science: Materials in Electronics. 33 (2022) 26 - p. 21127-21136 , 2022

Link: https://doi.org/10.1007/..

8

Interfacial Adhesion Energies of Uniformly Self-Formed Cr2O..:

Lee, Seongi ; Hwang, Soon-Gyu ; Kim, Gahui...
Electronic Materials Letters. 18 (2022) 5 - p. 447-455 , 2022

Link: https://doi.org/10.1007/..

9

Tailored Self-Assembled Monolayer using Chemical Coupling f..:

Lee, Seungmin ; Lee, Sanghyeon ; Lee, Minkyu...
ACS Applied Materials & Interfaces. 14 (2022) 50 - p. 56310-56320 , 2022

Link: https://doi.org/10.1021/..

10

Size Effect on the Electromigration Characteristics of Flip..:

Kim, Gahui ; Son, Kirak ; Lee, Jang-Hee..
Electronic Materials Letters. 18 (2022) 5 - p. 431-439 , 2022

Link: https://doi.org/10.1007/..

11

Atomic Layer Deposition of Ru for Replacing Cu-Interconnect:

Kotsugi, Yohei ; Han, Seung-Min ; Kim, Youn-Hye...
Chemistry of Materials. 33 (2021) 14 - p. 5639-5651 , 2021

Link: https://doi.org/10.1021/..

12

The Effect of Meal Replacement on Weight Loss According to ..:

Min, Jihyun ; Kim, Seo-Young ; Shin, In-Soo..
Journal of the Academy of Nutrition and Dietetics. 121 (2021) 8 - p. 1551-1564.e3 , 2021

Link: https://doi.org/10.1016/..

13

Interfacial adhesion energies of Ru–Mn direct plateable dif..:

Son, Kirak ; Kim, Youn-Hye ; Kim, Soo-Hyun.
Journal of Materials Science: Materials in Electronics. 32 (2021) 15 - p. 20559-20569 , 2021

Link: https://doi.org/10.1007/..

14

Degradation Mechanism of Interfacial Adhesion between Scree..:

Bae, Byung-Hyun ; Lee, Hyeonchul ; Kim, Gahui..
Electronic Materials Letters. 17 (2021) 2 - p. 157-163 , 2021

Link: https://doi.org/10.1007/..

15

Gamitaeeumjowee-Tang for weight loss in diabetic patients: ..:

Lee, A-Reum ; Lee, Da-Yeon ; Kim, Min-Ji...
Journal of Korean Medicine. 42 (2021) 1 - p. 46-58 , 2021

Link: https://doi.org/10.13048..