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X
Phommahaxay, A.
49  Ergebnisse:
Personensuche X
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1

Integration of epitaxial monolayer MX₂ channels on 300mm wa..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Ghosh, S. ; Smets, Q. ; Banerjee, S.... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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2

Origin of Voids at the SiO2/SiO2 and SiCN/SiCN Bonding Inte..:

Nagano, F. ; Inoue, F. ; Phommahaxay, A....
ECS Journal of Solid State Science and Technology.  12 (2023)  3 - p. 033002 , 2023
Link: https://doi.org/10.1149/..
 
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3

Void Formation Mechanism Related to Particles During Wafer-..:

Nagano, F. ; Iacovo, S. ; Phommahaxay, A....
ECS Journal of Solid State Science and Technology.  11 (2022)  6 - p. 063012 , 2022
Link: https://doi.org/10.1149/..
 
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4

Film Characterization of Low-Temperature Silicon Carbon Nit..:

Nagano, F. ; Iacovo, S. ; Phommahaxay, A....
ECS Journal of Solid State Science and Technology.  9 (2020)  12 - p. 123011 , 2020
Link: https://doi.org/10.1149/..
 
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5

Scaled transistors with 2D materials from the 300mm fab:

, In: 2020 IEEE Silicon Nanoelectronics Workshop (SNW),
Asselberghs, I. ; Schram, T. ; Smets, Q.... - p. 67-68 , 2020
Link: https://doi.org/10.1109/..
 
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6

Novell embedded microbump approach for die-to-die and wafer..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Derakhshandeh, J. ; Beyne, E. ; Capuz, G.... - p. 1-6 , 2019
Link: https://doi.org/10.23919..
 
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7

TSV-assisted hybrid FinFET CMOS — Silicon Photonics Technol..:

, In: 45th European Conference on Optical Communication (ECOC 2019),
Guermandi, D. ; Bogaerts, L. ; Rakowski, M.... - p. 1-4 , 2019
Link: https://doi.org/10.1049/..
 
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8

HIGH DENSITY AND HIGH BANDWIDTH CHIP-TO-CHIP CONNECTIONS WI..:

, In: 2018 International Wafer Level Packaging Conference (IWLPC),
Podpod ; Beyne, E. ; Velenis, D.... - p. 1-5 , 2018
Link: https://doi.org/10.23919..
 
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9

Temporary 0-Level MEMS Packaging Using a Heat Decomposable ..:

Bogaerts, L. ; Phommahaxay, A. ; Gerets, C....
Procedia Engineering.  25 (2011)  - p. 1497-1500 , 2011
Link: https://doi.org/10.1016/..
 
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10

High density, low leakage Back-End 3D capacitors for mixed ..:

Detalle, M. ; Barrenetxea, M. ; Muller, P....
Microelectronic Engineering.  87 (2010)  12 - p. 2571-2576 , 2010
Link: https://doi.org/10.1016/..
 
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11

IR Laser Release for 3D Stacked Devices: Effect of the Rele..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chancerel, Francois ; Urban, Peter ; Slabbekoorn, John... - p. 343-347 , 2024
Link: https://doi.org/10.1109/..
 
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12

Multi-tier die stacking through collective die-to-wafer hyb..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kennes, Koen ; Lin, Ye ; Suhard, Samuel... - p. 637-642 , 2024
Link: https://doi.org/10.1109/..
 
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13

Collective die-to-wafer assembly process for optically inte..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kennes, Koen ; Dvoretskii, Anton ; Podpod, Arnita... - p. 1392-1397 , 2024
Link: https://doi.org/10.1109/..
 
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14

Detection of bonding voids in multi-tier stacks with scanni..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chen, Cong ; Slabbekoorn, John ; Bogdanowicz, Janusz... - p. 320-325 , 2023
Link: https://doi.org/10.1109/..
 
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15

A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Iacovo, Serena ; D'have, Koen ; Okudur, Oguzhan Orkut... - p. 1410-1417 , 2023
Link: https://doi.org/10.1109/..
 
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