Plachy, Zbynek
13  Ergebnisse:
Personensuche X
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1

Board Level Underfill – Moisture Related Voids:

, In: 2024 47th International Spring Seminar on Electronics Technology (ISSE),
 
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2

Influence of Reflow Temperature Profile on the Intermetalli..:

, In: 2024 47th International Spring Seminar on Electronics Technology (ISSE),
Dusek, Karel ; Vesely, Petr ; Busek, David... - p. 1-4 , 2024
 
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3

Sustainability Challenges: The Circular Economy Dilemma in ..:

, In: 2024 47th International Spring Seminar on Electronics Technology (ISSE),
 
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4

Unlocking Insights: A Systematic Survey of Material Composi..:

, In: 2024 47th International Spring Seminar on Electronics Technology (ISSE),
 
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5

Sustainable printed circuit board substrates based on flame..:

Farkas, Csaba ; Gál, László ; Csiszár, András...
Sustainable Materials and Technologies.  40 (2024)  - p. e00902 , 2024
 
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8

Board Level Underfill – the Influence of Flux:

, In: 2023 46th International Spring Seminar on Electronics Technology (ISSE),
 
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9

Techno-Environmental Evaluation of Recycling Pretreatment o..:

, In: 2023 46th International Spring Seminar on Electronics Technology (ISSE),
 
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10

Behaviour of Moisture Sensitive Devices:

, In: 2022 45th International Spring Seminar on Electronics Technology (ISSE),
Plachy, Zbynek ; Dusek, Karel - p. 1-5 , 2022
 
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11

A Weakness of Wetting Balance Method during the Diagnostic ..:

, In: 2022 45th International Spring Seminar on Electronics Technology (ISSE),
Dusek, Karel ; Vesely, Petr ; Fros, Denis... - p. 1-5 , 2022
 
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