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Planes, N
224  Ergebnisse:
Personensuche X
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1

Robustness Assessment Through 77GHz Operating Life Test of ..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Cacho, F. ; Cathelin, P. ; Hai, J.... - p. 4B.3-1-4B.3-6 , 2024
Link: https://doi.org/10.1109/..
 
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2

28nm FDSOI CMOS technology (FEOL and BEOL) thermal stabilit..:

, In: 2020 IEEE Symposium on VLSI Technology,
Cavalcante, C. ; Fenouillet-Beranzer, C. ; Batude, P.... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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3

Low-Frequency Noise Transistor Performance for UTBB FDSOI M..:

, In: 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S),
Van Brandt, L. ; Esfeh, B. Kazemi ; Planes, N... - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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4

28 nm FDSOI analog and RF Figures of Merit at N2 cryogenic ..:

Kazemi Esfeh, B. ; Planes, N. ; Haond, M....
Solid-State Electronics.  159 (2019)  - p. 77-82 , 2019
Link: https://doi.org/10.1016/..
 
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5

28 FDSOI RF Figures of Merit down to 4.2 K:

, In: 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S),
Nyssens, L. ; Halder, A. ; Esfeh, B. Kazemi... - p. 1-3 , 2019
Link: https://doi.org/10.1109/..
 
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6

An in-depth analysis of temperature effect on DIBL in UTBB ..:

Pereira, A.S.N. ; de Streel, G. ; Planes, N....
Solid-State Electronics.  128 (2017)  - p. 67-71 , 2017
Link: https://doi.org/10.1016/..
 
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7

Comparison of self-heating and its effect on analogue perfo..:

Makovejev, S. ; Planes, N. ; Haond, M....
Solid-State Electronics.  115 (2016)  - p. 219-224 , 2016
Link: https://doi.org/10.1016/..
 
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8

Characterization and modeling of drain current local variab..:

Ioannidis, E.G. ; Haendler, S. ; Josse, E...
Solid-State Electronics.  118 (2016)  - p. 4-11 , 2016
Link: https://doi.org/10.1016/..
 
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9

Assessment of 28 nm UTBB FD-SOI technology platform for RF ..:

Kazemi Esfeh, B. ; Kilchytska, V. ; Barral, V....
Solid-State Electronics.  117 (2016)  - p. 130-137 , 2016
Link: https://doi.org/10.1016/..
 
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10

Hot-carrier degradation model for nanoscale ultra-thin body..:

Karatsori, T.A. ; Theodorou, C.G. ; Haendler, S....
Microelectronic Engineering.  159 (2016)  - p. 9-16 , 2016
Link: https://doi.org/10.1016/..
 
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11

Wide frequency band assessment of 28nm FDSOI technology pla..:

Makovejev, S. ; Kazemi Esfeh, B. ; Barral, V....
Solid-State Electronics.  108 (2015)  - p. 47-52 , 2015
Link: https://doi.org/10.1016/..
 
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12

Impact of local back biasing on performance in hybrid FDSOI..:

Fenouillet-Beranger, C. ; Perreau, P. ; Benoist, T....
Solid-State Electronics.  88 (2013)  - p. 15-20 , 2013
Link: https://doi.org/10.1016/..
 
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13

65nm LP/GP mix low cost platform for multi-media wireless a..:

Tavel, B. ; Duriez, B. ; Gwoziecki, R....
Solid-State Electronics.  50 (2006)  4 - p. 573-578 , 2006
Link: https://doi.org/10.1016/..
 
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14

SOL Thinning Effects on 3C-SiC on SOI*:

Planes, N. ; Möller, H. ; Camassel, Jean...
Materials Science Forum.  338-342 (2000)  - p. 301-304 , 2000
Link: https://doi.org/10.4028/..
 
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15

Characterization of 3C-SiC/SOI Deposited with HMDS:

Planes, N. ; Dupel, P. ; Ravetz, M....
Materials Science Forum.  338-342 (2000)  - p. 599-602 , 2000
Link: https://doi.org/10.4028/..
 
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