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Qu, Xin-ping
7261  Ergebnisse:
Personensuche X
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1

Investigation of a Single-Component Additive for Bottom-Up ..:

Qiu, Lina ; Ni, Zi-Hong ; Sun, Qiancheng..
The Journal of Physical Chemistry C.  128 (2024)  25 - p. 10336-10346 , 2024
Link: https://doi.org/10.1021/..
 
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2

Comparison between the solid state reaction of ultrathin Ni..:

Gu, Sijie ; Shu, Gangqiang ; Hu, Chun-Feng.
Thin Solid Films.  781 (2023)  - p. 139998 , 2023
Link: https://doi.org/10.1016/..
 
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3

The Effect of Surfactants on the Removal of Ceria Particles..:

Wang, Yingjie ; Sun, Qiancheng ; Tang, Wenlong...
ECS Journal of Solid State Science and Technology.  12 (2023)  9 - p. 094002 , 2023
Link: https://doi.org/10.1149/..
 
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4

Cleaning Nanoceria Particles by Diluted HNO3 with H2O2 Mixt..:

Wang, Yingjie ; Wu, Bingbing ; Qiu, Li-Na...
ECS Journal of Solid State Science and Technology.  12 (2023)  1 - p. 014001 , 2023
Link: https://doi.org/10.1149/..
 
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5

Wet processes deposition for HAR TSV metallization using el..:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),
Qiu, Li-Na ; Ni, Zi-Hong ; Qu, Xin-Ping - p. 96-98 , 2022
Link: https://doi.org/10.1109/..
 
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6

Investigation of RuZn alloy as barrier to Cu interconnect:

Wang, Peng ; Qu, Xin-Ping ; Dordi, Yezdi.
Journal of Materials Science: Materials in Electronics.  33 (2022)  9 - p. 6318-6328 , 2022
Link: https://doi.org/10.1007/..
 
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7

Electroless Deposition of Pure Co on TaN Substrate for Inte..:

Qiu, Li-Na ; Ni, Zi-Hong ; Wang, Ying-Jie..
Journal of The Electrochemical Society.  169 (2022)  7 - p. 072507 , 2022
Link: https://doi.org/10.1149/..
 
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8

Dual Active Layer Mg-Doped InZnO Thin-Film Transistors with..:

, In: 2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT),
Hu, Chun-Feng ; Zou, Zhongfei ; Wang, Mingxiang. - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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9

Removal of Nanoceria Abrasive Particles by Using Diluted SC..:

Wu, Bingbing ; Wang, Peng ; Wang, Yingjie...
ECS Journal of Solid State Science and Technology.  10 (2021)  3 - p. 034010 , 2021
Link: https://doi.org/10.1149/..
 
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10

Linewidth related resistivities and growth behavior of nick..:

Shu, Gangqiang ; Hu, Chunfeng ; Teng, Tong.
Thin Solid Films.  724 (2021)  - p. 138612 , 2021
Link: https://doi.org/10.1016/..
 
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11

Electrodeposition of Cu on CoTa Barrier in the Alkaline CuS..:

Qiu, Li-Na ; Wang, Xu ; Hu, Chun-Feng.
Journal of The Electrochemical Society.  168 (2021)  6 - p. 062501 , 2021
Link: https://doi.org/10.1149/..
 
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12

The photoresponsivity of monolayer molybdenum disulfide gro..:

Yang, Ai-Guo ; Chen, Jiajun ; Yang, Peng...
Applied Physics Express.  13 (2020)  7 - p. 071006 , 2020
Link: https://doi.org/10.35848..
 
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13

Investigation on inhibition of ruthenium corrosion by glyci..:

Shao, Shuai ; Wu, Bingbing ; Wang, Peng..
Applied Surface Science.  506 (2020)  - p. 144976 , 2020
Link: https://doi.org/10.1016/..
 
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14

Investigation of the anomalous hump phenomenon in amorphous..:

Teng, Tong ; Hu, Chun-Feng ; Qu, Xin-Ping.
Solid-State Electronics.  170 (2020)  - p. 107814 , 2020
Link: https://doi.org/10.1016/..
 
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15

Seizure Characteristics, Outcome, and Risk of Epilepsy in P..:

Qu, Xin-ping ; Vidaurre, Jorge ; Peng, Xiao-ling...
Pediatric Neurology.  105 (2020)  - p. 35-40 , 2020
Link: https://doi.org/10.1016/..
 
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