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Radisic, Aleksandar
78  Ergebnisse:
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1

3D interconnects for quantum computing:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Dangol, Anish ; Hussain, Tassawar... - p. 821-828 , 2024
Link: https://doi.org/10.1109/..
 
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2

Copper Rich Cu1-xNix Alloys (0.05 < x < 0.15) Electrodeposi..:

Haesevoets, Karel P. S. ; Radisic, Aleksandar ; Vereecken, Philippe M.
Journal of The Electrochemical Society.  166 (2019)  8 - p. D315-D322 , 2019
Link: https://doi.org/10.1149/..
 
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3

Nanometer-Thin Graphitic Carbon Buffer Layers for Electroly..:

Deheryan, Stella ; Zargouni, Yafa ; Sinha, Rochan...
Journal of The Electrochemical Society.  164 (2017)  2 - p. A538-A544 , 2017
Link: https://doi.org/10.1149/..
 
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4

The Effect of the Substrate Characteristics on the Electroc..:

Nagar, Magi ; Radisic, Aleksandar ; Strubbe, Katrien.
Journal of The Electrochemical Society.  163 (2016)  12 - p. D3053-D3061 , 2016
Link: https://doi.org/10.1149/..
 
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5

Height Uniformity of Micro-Bumps Electroplated on Thin Cu S..:

Yang, Liu ; Slabbekoorn, John ; Honore, Mia...
ECS Transactions.  72 (2016)  4 - p. 145-152 , 2016
Link: https://doi.org/10.1149/..
 
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6

The Limitation and Optimization of Bottom-Up Growth Mode in..:

Yang, Liu ; Radisic, Aleksandar ; Deconinck, Johan.
Journal of The Electrochemical Society.  162 (2015)  14 - p. D599-D604 , 2015
Link: https://doi.org/10.1149/..
 
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7

Electrochemical Deposition of Manganese Oxides on Carbon Na..:

Radisic, Aleksandar ; Cott, Daire J. ; Deheryan, Stella...
ECS Transactions.  61 (2014)  9 - p. 1-7 , 2014
Link: https://doi.org/10.1149/..
 
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8

Electrodeposition and Characterization of Manganese Dioxide..:

Zargouni, Yafa ; Deheryan, Stella ; Radisic, Aleksandar...
ECS Transactions.  61 (2014)  9 - p. 29-41 , 2014
Link: https://doi.org/10.1149/..
 
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9

Effect of Film Morphology on the Li Ion Intercalation Kinet..:

Etman, Ahmed S. ; Radisic, Aleksandar ; Emara, Mahmoud M...
The Journal of Physical Chemistry C.  118 (2014)  19 - p. 9889-9898 , 2014
Link: https://doi.org/10.1021/..
 
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10

Stochastic Modeling of Polyethylene Glycol as a Suppressor ..:

Yang, Liu ; Radisic, Aleksandar ; Deconinck, Johan.
Journal of The Electrochemical Society.  161 (2014)  5 - p. D269-D276 , 2014
Link: https://doi.org/10.1149/..
 
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11

Modeling the Bottom-Up Filling of Through-Silicon vias Thro..:

Yang, Liu ; Radisic, Aleksandar ; Deconinck, Johan.
Journal of The Electrochemical Society.  160 (2013)  12 - p. D3051-D3056 , 2013
Link: https://doi.org/10.1149/..
 
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12

Electroless Cu deposition on atomic layer deposited Ru as n..:

Inoue, Fumihiro ; Philipsen, Harold ; Radisic, Aleksandar...
Electrochimica Acta.  100 (2013)  - p. 203-211 , 2013
Link: https://doi.org/10.1016/..
 
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13

Wafer-scale Cu plating uniformity on thin Cu seed layers:

Yang, Liu ; Atanasova, Tanya ; Radisic, Aleksandar...
Electrochimica Acta.  104 (2013)  - p. 242-248 , 2013
Link: https://doi.org/10.1016/..
 
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14

Nucleation and Growth of Copper on Ru-Based Substrates: I. ..:

Nagar, Magi ; Vereecken, Philippe M. ; Strubbe, Katrien.
ECS Transactions.  41 (2012)  35 - p. 75-82 , 2012
Link: https://doi.org/10.1149/..
 
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15

Nucleation and Growth of Copper on Ru-Based Substrates: II...:

Nagar, Magi ; Radisic, Aleksandar ; Strubbe, Katrien.
ECS Transactions.  41 (2012)  35 - p. 99-110 , 2012
Link: https://doi.org/10.1149/..
 
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