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2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) ,
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High Speed Silicon Wet Bulk Micromachining of Si{111} in KO..:
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Springer Proceedings in Physics; The Physics of Semiconductor Devices ,
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Silicon Etching Characteristics in Modified TMAH Solution:
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Springer Proceedings in Physics; The Physics of Semiconductor Devices ,
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Study of Cutting-Edge AFM Modalities and SEM Techniques in ..:
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Microactuators, Microsensors and Micromechanisms; Mechanisms and Machine Science ,
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