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Retnasamy, Vithyacharan
14  Ergebnisse:
Personensuche X
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1

Reactive Ion Etching Parameter Effect on Aluminum Bond Pad ..:

Palianysamy, Moganraj ; Sauli, Zaliman ; Hashim, Uda...
Advanced Materials Research.  925 (2014)  - p. 84-87 , 2014
Link: https://doi.org/10.4028/..
 
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2

Main Effects of Lattice Parameter in Ba0.65Sr0.35TiO3 Thin ..:

Sauli, Zaliman ; Retnasamy, Vithyacharan ; Palianysamy, Moganraj...
Procedia - Social and Behavioral Sciences.  129 (2014)  - p. 512-517 , 2014
Link: https://doi.org/10.1016/..
 
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3

Polymer Core BGA Stress Analysis at Higher Vertical Loading:

Sauli, Zaliman ; Retnasamy, Vithyacharan ; Vairavan, Rajendaran..
Procedia - Social and Behavioral Sciences.  129 (2014)  - p. 430-435 , 2014
Link: https://doi.org/10.1016/..
 
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4

Surface Roughness Influence on O2 and Ar RIE Gas Treated Al..:

Sauli, Zaliman ; Retnasamy, Vithyacharan ; Hashim, Uda...
Advanced Materials Research.  925 (2014)  - p. 92-95 , 2014
Link: https://doi.org/10.4028/..
 
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5

Effect of High Temperature during Electroless Nickel Proces:

Sauli, Zaliman ; Retnasamy, Vithyacharan ; Hashim, Uda...
Advanced Materials Research.  925 (2014)  - p. 88-91 , 2014
Link: https://doi.org/10.4028/..
 
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6

Chemical Bath Temperature Investigation for Electroless Nic..:

Retnasamy, Vithyacharan ; Sauli, Zaliman ; Hashim, Uda...
Advanced Materials Research.  925 (2014)  - p. 96-100 , 2014
Link: https://doi.org/10.4028/..
 
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7

Wire Bond Shear Test Simulation on Flat Surface Bond Pad:

Sauli, Zaliman ; Retnasamy, Vithyacharan ; Vairavan, Rajendaran..
Procedia - Social and Behavioral Sciences.  129 (2014)  - p. 328-333 , 2014
Link: https://doi.org/10.1016/..
 
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8

Reactive Ion Etching Parameter Effect on Aluminum Bond Pad ..:

Palianysamy, Moganraj ; Sauli, Zaliman ; Hashim, Uda...
Advanced Materials Research.  925 (2014)  - p. 140-143 , 2014
Link: https://doi.org/10.4028/..
 
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9

Wettability and Surface Roughness Study on RIE Treated Alum..:

Retnasamy, Vithyacharan ; Sauli, Zaliman ; Hashim, Uda...
Advanced Materials Research.  925 (2014)  - p. 101-104 , 2014
Link: https://doi.org/10.4028/..
 
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10

Ionic contaminations level and cleaning flip chip BGA packa..:

Boon Kar, Yap ; Azrina Talik, Noor ; Sauli, Zaliman...
Microelectronics International.  30 (2013)  2 - p. 99-103 , 2013
Link: https://doi.org/10.1108/..
 
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11

Finite element analysis of thermal distributions of solder ..:

Boon Kar, Yap ; Azrina Talik, Noor ; Sauli, Zaliman..
Microelectronics International.  30 (2013)  1 - p. 14-18 , 2013
Link: https://doi.org/10.1108/..
 
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12

Digital fringe projection for hand surface coordinate varia..:

Wan Nor Haimi Wan Mokhdzani ; Tan Cheek Hau ; Retnasamy Vithyacharan...
https://doi.org/10.1051/epjconf/201716201036.  , 2017
Link: https://doi.org/10.1051/..
 
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13

Effects of air temperature and velocity on the drying kinet..:

Caparanga Alvin R ; Reyes Rachael Anne L ; Rivas Reiner L...
https://doi.org/10.1051/epjconf/201716201084.  , 2017
Link: https://doi.org/10.1051/..
 
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14

Critical analysis of stability and performance of organomet..:

Suhaimi Suriati ; Sauli Zaliman ; Ahmad Hambali Nor Azura Malini...
https://doi.org/10.1051/epjconf/201716201043.  , 2017
Link: https://doi.org/10.1051/..
 
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