Roudet, A.
614  Ergebnisse:
Personensuche X
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1

Part 1: Outcome of Posterior Pelvic Ring Injuries and Assoc..:

Boudissa, Mehdi ; Roudet, A. ; Fumat, V....
International Orthopaedics.  44 (2020)  6 - p. 1209-1215 , 2020
 
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4

Classification of winegrape cultivars in Chile and France a..:

Paňitrur-De La Fuente, C. ; Valdés-Gómez, H. ; Roudet, J....
Australian Journal of Grape and Wine Research.  24 (2017)  2 - p. 145-157 , 2017
 
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7

Environmental effects on the production ofBotrytis cinereac..:

Ciliberti, N. ; Fermaud, M. ; Roudet, J...
Australian Journal of Grape and Wine Research.  22 (2016)  2 - p. 262-270 , 2016
 
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8

New multipest damage indicator to assess protection strateg..:

Fermaud, M. ; Smits, N. ; Merot, A....
Australian Journal of Grape and Wine Research.  22 (2016)  3 - p. 450-461 , 2016
 
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9

Acute traumatic patellar tendon rupture: Early and late res..:

Roudet, A. ; Boudissa, M. ; Chaussard, C...
Orthopaedics & Traumatology: Surgery & Research.  101 (2015)  3 - p. 307-311 , 2015
 
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10

The accurate input impedances of a DC-DC converters connect..:

, In: 2015 IEEE 15th International Conference on Environment and Electrical Engineering (EEEIC),
Ales, A. ; Gouichiche, Z. ; Schanen, J-L.... - p. 331-336 , 2015
 
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11

Acute quadriceps tendon ruptures: A series of 50 knees with..:

Boudissa, M. ; Roudet, A. ; Rubens-Duval, B...
Orthopaedics & Traumatology: Surgery & Research.  100 (2014)  2 - p. 217-220 , 2014
 
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13

Studying behavior of multilayer materials: A 1-D model corr..:

Ahmadi, B. ; Chazal, H. ; Waeckerle, T..
Journal of Magnetism and Magnetic Materials.  320 (2008)  20 - p. e708-e711 , 2008
 
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14

FEM‐PEEC coupled method for modeling solid conductors in th..:

Tran, T‐S. ; Meunier, G. ; Labie, P....
COMPEL - The international journal for computation and mathematics in electrical and electronic engineering.  27 (2008)  4 - p. 904-910 , 2008
 
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15

An analytical process to size a flyback converter:

Schutz, J. ; Gerbaud, L. ; Roudet, J..
COMPEL - The international journal for computation and mathematics in electrical and electronic engineering.  20 (2001)  3 - p. 796-807 , 2001
 
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